SCHEMBL2478520

SCHEMBL2478520

CCSCC(S)SCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21765987 0.76
SCHEMBL27966251 0.75
SCHEMBL4368287 0.75
SCHEMBL16207470 0.74
SCHEMBL4973705 0.73
SCHEMBL11873304 0.73
SCHEMBL8733915 0.73
SCHEMBL11570715 0.71
SCHEMBL29215284 0.71
SCHEMBL5409067 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1223190-B1 Room temperature curable organopolysiloxane composition for molding SHINETSU CHEMICAL CO (JP) 2011-10-12 EP claimed
US-7078460-B2 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-07-18 US claimed
US-20040010109-A1 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-15 US claimed
EP-1223190-B1 Room temperature curable organopolysiloxane composition for molding SHINETSU CHEMICAL CO (JP) 2011-10-12 EP disclosed
US-7078460-B2 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-07-18 US disclosed
US-20040010109-A1 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-15 US disclosed
US-20020132912-A1 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-09-19 US disclosed
EP-1223190-A1 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-07-17 EP disclosed