⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13720753 | 0.71 | — | — | |
| SCHEMBL3533101 | 0.59 | — | — | |
| SCHEMBL10677414 | 0.59 | — | — | |
| SCHEMBL6394541 | 0.57 | — | — | |
| SCHEMBL1382945 | 0.57 | — | — | |
| SCHEMBL11957633 | 0.55 | — | — | |
| SCHEMBL17375061 | 0.50 | — | — | |
| SCHEMBL5899078 | 0.50 | — | — | |
| SCHEMBL10677407 | 0.46 | — | — | |
| SCHEMBL9186401 | 0.46 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240240059-A1 | EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION | OTSUKA CHEMICAL CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| WO-2023276702-A1 | EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION | 大塚化学株式会社 | 2023-01-05 | — | — | WO | disclosed |