⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL87725 | 0.91 | — | — | |
| SCHEMBL8503534 | 0.91 | — | — | |
| SCHEMBL5174140 | 0.91 | — | — | |
| SCHEMBL12470801 | 0.91 | — | — | |
| SCHEMBL21457927 | 0.91 | — | — | |
| SCHEMBL2400500 | 0.91 | — | — | |
| SCHEMBL17263 | 0.91 | — | — | |
| SCHEMBL11356950 | 0.91 | — | — | |
| SCHEMBL563427 | 0.91 | — | — | |
| SCHEMBL23716983 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025022383-A1 | LITHIUM EXTRACTION FROM MINERAL ORES | HELIOS PROJECT LTD. (IL) | 2025-01-30 | — | — | WO | claimed |
| US-20020022565-A1 | Materials to fabricate a high resolution plasma display back panel | SARNOFF CORPORATION | 2002-02-21 | — | — | US | claimed |
| WO-2025022383-A1 | LITHIUM EXTRACTION FROM MINERAL ORES | HELIOS PROJECT LTD. (IL) | 2025-01-30 | — | — | WO | disclosed |
| CN-116230757-A | Schottky short-circuit point reverse blocking double-end solid-state thyratron and preparation method thereof | 华中科技大学 | 2023-06-06 | — | — | CN | disclosed |
| EP-1786250-B1 | Composite wiring board and manufacturing method thereof | TDK CORP (JP) | 2011-10-19 | — | — | EP | disclosed |
| US-7733663-B2 | Multilayer ceramic substrate | TDK CORPORATION (JP) | 2010-06-08 | — | — | US | disclosed |
| US-20100018630-A1 | Method of manufacturing composite wiring board | TDK CORPORATION (JP) | 2010-01-28 | — | — | US | disclosed |
| EP-1720203-B1 | Production method of a multilayer ceramic substrate | TDK CORP (JP) | 2010-01-13 | — | — | EP | disclosed |
| US-7578058-B2 | Production method of a multilayer ceramic substrate | TDK CORPORATION (JP) | 2009-08-25 | — | — | US | disclosed |
| US-20080283281-A1 | Multilayer ceramic substrate | TDK CORPORATION (JP) | 2008-11-20 | — | — | US | disclosed |
| US-20070108586-A1 | Composite wiring board and manufacturing method thereof | TDK CORPORATION (JP) | 2007-05-17 | — | — | US | disclosed |
| EP-1786250-A1 | Composite wiring board and manufacturing method thereof | TDK Corporation (JP) | 2007-05-16 | — | — | EP | disclosed |
| EP-1720203-A2 | Multilayer ceramic substrate and production method thereof | TDK Corporation (JP) | 2006-11-08 | — | — | EP | disclosed |
| US-20060234023-A1 | Multilayer ceramic substrate and production method thereof | TDK CORPORATION (JP) | 2006-10-19 | — | — | US | disclosed |
| EP-0265340-B1 | MULTILAYER CERAMIC COPPER CIRCUIT BOARD | FUJITSU LIMITED (JP) | 1991-03-06 | — | — | EP | disclosed |
| US-4939021-A | Multilayer ceramic copper circuit board | FUJITSU LIMITED (JP) | 1990-07-03 | — | — | US | disclosed |
| EP-0265340-A2 | Multilayer ceramic copper circuit board | FUJITSU LIMITED (JP) | 1988-04-27 | — | — | EP | disclosed |