⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL7117518 | 0.97 | — | — | |
| SCHEMBL8846932 | 0.79 | CDC25A (0.33) | — | |
| SCHEMBL8846944 | 0.75 | CDC25A (0.38) | — | |
| SCHEMBL11236383 | 0.74 | CDC25A (0.41) | — | |
| SCHEMBL18631956 | 0.72 | — | — | |
| SCHEMBL3762929 | 0.72 | — | — | |
| SCHEMBL19286502 | 0.72 | — | — | |
| SCHEMBL3762932 | 0.72 | — | — | |
| SCHEMBL3758050 | 0.72 | — | — | |
| SCHEMBL17797109 | 0.72 | CDC25A (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 285 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122038059-A | Cleaning composition for removing post-etch residues | 恩特格里斯公司 | 2026-05-15 | — | — | CN | claimed |
| EP-4643371-A1 | COMPOSITION FOR SELECTIVELY REMOVING OXIDE COMPOUNDS AND ETCHING RESIDUES OF ONE OR BOTH OF CO AND CU | BASF SE (DE) | 2025-11-05 | — | — | EP | claimed |
| US-12331239-B2 | Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt | BASF SE (DE) | 2025-06-17 | — | — | US | claimed |
| CN-118895506-A | Copper etching solution composition and application thereof | 四川和晟达电子科技有限公司 | 2024-11-05 | — | — | CN | claimed |
| WO-2024141400-A1 | COMPOSITION FOR SELECTIVELY REMOVING OXIDE COMPOUNDS AND ETCHING RESIDUES OF ONE OR BOTH OF CO AND CU | BASF SE (DE) | 2024-07-04 | — | — | WO | claimed |
| US-20240093089-A1 | COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A LAYER COMPRISING AN ALUMINIUM COMPOUND IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER AND/OR COBALT | BASF SE (DE) | 2024-03-21 | — | — | US | claimed |
| EP-4257625-A1 | HCFO-CONTAINING ISOCYANATE-REACTIVE COMPOSITIONS, RELATED FOAM-FORMING COMPOSITIONS AND FOAMS | Covestro LLC (US) | 2023-10-11 | — | — | EP | claimed |
| US-20230303757-A1 | HCFO-CONTAINING ISOCYANATE-REACTIVE COMPOSITIONS, RELATED FOAM-FORMING COMPOSITIONS AND FOAMS | COVESTRO LLC | 2023-09-28 | — | — | US | claimed |
| US-20220267673-A1 | ETCHING COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES BY USING THE SAME | DONGWOO FINE-CHEM CO., LTD. (KR) | 2022-08-25 | — | — | US | claimed |
| US-11127587-B2 | Non-amine post-CMP compositions and method of use | ENTEGRIS, INC. (US) | 2021-09-21 | — | — | US | claimed |
| WO-2008058173-A2 | FORMULATIONS FOR CLEANING MEMORY DEVICE STRUCTURES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-05-15 | — | — | WO | claimed |
| EP-1871612-A1 | INKJET ANTI-CURL COMPOSITIONS FOR MEDIA AND SYSTEMS FOR PROCESSING THE MEDIA | Hewlett-Packard Development Company, L.P. (US) | 2008-01-02 | — | — | EP | claimed |
| WO-2007120259-A2 | FORMULATIONS FOR REMOVING COPPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | claimed |
| WO-2007111694-A2 | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LOW-K DIELECTRIC MATERIALS THEREON | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-10-04 | — | — | WO | claimed |
| CN-101027371-A | Co-solvents in printing fluids | HEWLETT PACKARD DEVELOPMENT CO (US) | 2007-08-29 | — | — | CN | claimed |
| WO-2007044446-A1 | OXIDIZING AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-04-19 | — | — | WO | claimed |
| WO-2006116770-A2 | METHOD OF PASSIVATING CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER FILM PLANARIZATION PROCESSES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-11-02 | — | — | WO | claimed |
| WO-2006113113-A1 | INKJET ANTI-CURL COMPOSITIONS FOR MEDIA AND SYSTEMS FOR PROCESSING THE MEDIA | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2006-10-26 | — | — | WO | claimed |
| US-20060233975-A1 | Inkjet anti-curl compositions for media and systems for processing the media | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2006-10-19 | — | — | US | claimed |
| US-20030144453-A1 | Process for the production of polyurethanes and/or polyureas using amine-N-oxide catalysts and compounds containing amine-N-oxides | FRAUENDORFER ERICH (DE) | 2003-07-31 | — | — | US | claimed |