⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11118963 | 0.72 | — | — | |
| SCHEMBL4355677 | 0.69 | — | — | |
| SCHEMBL1450583 | 0.65 | — | — | |
| SCHEMBL1450609 | 0.65 | — | — | |
| Nitric Acid SCHEMBL5448538 | 0.62 | — | — | |
| SCHEMBL13346292 | 0.60 | — | — | |
| SCHEMBL8459791 | 0.59 | — | — | |
| SCHEMBL5447695 | 0.59 | — | — | |
| SCHEMBL6209480 | 0.56 | — | — | |
| SCHEMBL9212606 | 0.55 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2020133335-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL-CLADDED LAMINATE, AND PRINTED CIRCUIT BOARD | 广东生益科技股份有限公司 | 2020-07-02 | — | — | WO | claimed |
| WO-2020133338-A1 | THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND HIGH-FREQUENCY CIRCUIT SUBSTRATE CONTAINING SAME | 广东生益科技股份有限公司 | 2020-07-02 | — | — | WO | claimed |
| WO-2020124673-A1 | THERMOSETTING RESIN COMPOSITION AND PREPREG USING SAME, LAMINATE, AND METAL FOIL-CLAD LAMINATE | 广东生益科技股份有限公司 | 2020-06-25 | — | — | WO | claimed |
| WO-2024043553-A1 | POLYOL COMPOSITION AND PREPARATION METHOD THEREFOR, COMPOSITION FOR POLYURETHANE PREPARATION COMPRISING POLYOL COMPOSITION, AND BATTERY MODULE | 에스케이피유코어 주식회사 | 2024-02-29 | — | — | WO | disclosed |
| US-20240052093-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2024-02-15 | — | — | US | disclosed |
| WO-2024024525-A1 | EPOXY RESIN, RESIN COMPOSITION THEREOF, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING EPOXY RESIN | 日鉄ケミカル＆マテリアル株式会社 | 2024-02-01 | — | — | WO | disclosed |
| US-11810778-B2 | Optical semiconductor element mounting package and optical semiconductor device using the same | SHENZHEN JUFEI OPTOELECTRONICS CO., LTD. (CN) | 2023-11-07 | — | — | US | disclosed |
| US-20230331945-A1 | COMPOSITE MATERIALS WITH MICA BASED SURFACING LAYER | VON ROLL SCHWEIZ AG (CH) | 2023-10-19 | — | — | US | disclosed |
| WO-2023167019-A1 | PHOSPHORUS-CONTAINING (METH)ACRYLOYL COMPOUND, METHOD FOR PRODUCING SAME, AND FLAME-RETARDANT COMPOSITION AND LAMINATED BOARD FOR ELECTRONIC CIRCUIT BOARD CONTAINING SAME | 日鉄ケミカル＆マテリアル株式会社 | 2023-09-07 | — | — | WO | disclosed |
| US-20230242691-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-08-03 | — | — | US | disclosed |
| WO-2023100572-A1 | POLYHYDRIC HYDROXY RESIN, EPOXY RESIN, AND METHODS FOR PRODUCING THOSE, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | 日鉄ケミカル＆マテリアル株式会社 | 2023-06-08 | — | — | WO | disclosed |
| EP-2676983-B1 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI RAYON CO (JP) | 2016-07-20 | — | — | EP | disclosed |
| US-20160035951-A1 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| US-9076932-B2 | Optical semiconductor element mounting package, and optical semiconductor device using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-07-07 | — | — | US | disclosed |
| US-20140319569-A1 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | RESONAC CORPORATION (JP) | 2014-10-30 | — | — | US | disclosed |
| EP-2676983-A1 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | Mitsubishi Rayon Co., Ltd. (JP) | 2013-12-25 | — | — | EP | disclosed |
| US-20110241055-A1 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | RESONAC CORPORATION (JP) | 2011-10-06 | — | — | US | disclosed |
| CN-101128501-B | Epoxy resin, curable resin composition containing epoxy resin and use thereof | NIPPON KAYAKU KK | 2010-12-08 | — | — | CN | disclosed |
| CN-101128501-A | Epoxy resin, curable resin composition containing epoxy resin and use thereof | NIPPON KAYAKU KK (JP) | 2008-02-20 | — | — | CN | disclosed |
| US-6221494-B1 | CROSSLINKING; CURABLE | E.I. DU PONT DE NEMOURS AND COMPANY | 2001-04-24 | — | — | US | disclosed |