SCHEMBL2512915

SCHEMBL2512915

CC(C)O[Si](OC(C)C)(OC(C)C)O[Si](OC(C)C)(OC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11256570 0.96
SCHEMBL34902 0.84
SCHEMBL18406262 0.83
SCHEMBL26034981 0.81
SCHEMBL2531649 0.80
SCHEMBL26106889 0.80
SCHEMBL29518737 0.78
SCHEMBL17522115 0.78
SCHEMBL16021808 0.76
SCHEMBL938341 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11753307-B2 Modified zeolites that include hafnium-containing organometallic moieties and methods for making such SAUDI ARABIAN OIL COMPANY (SA) 2023-09-12 US disclosed
US-11731882-B2 Modified zeolites that include titanium-containing organometallic moieties and methods for making such SAUDI ARABIAN OIL COMPANY (SA) 2023-08-22 US disclosed
US-11731881-B2 Modified zeolites that include zirconium-containing organometallic moieties and methods for making such SAUDI ARABIAN OIL COMPANY (SA) 2023-08-22 US disclosed
US-8034545-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2011-10-11 US disclosed
US-20090220897-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL CO., LTD. (JP) 2009-09-03 US disclosed
US-20090214796-A1 Method for Forming Antireflection Film MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2009-08-27 US disclosed
US-20080260956-A1 Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part HITACHI CHEMICAL CO., LTD. (JP) 2008-10-23 US disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
US-7297464-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2007-11-20 US disclosed
EP-1829945-A1 FILM, SILICA FILM AND METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING SILICA FILM, AND ELECTRONIC PART Hitachi Chemical Co., Ltd. (JP) 2007-09-05 EP disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed
EP-1167406-B1 High energy radiation-curable composition and resin molding DOW CORNING TORAY SILICONE (JP) 2005-01-12 EP disclosed
US-6515041-B2 A partial hydrolysis-condensation product of (A) a mixture of an alkoxy containig organopolysiloxane and alkoxysilanes and (B) a multifunctional acrylate; superior curability, waterproofing, oil repellency, flexibility and transparancy DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-02-04 US disclosed
US-20020016380-A1 High energy radiation-curable composition and resin molding DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 2002-02-07 US disclosed
EP-1167406-A1 High energy radiation-curable composition and resin molding Dow Corning Toray Silicone Co., Ltd. (JP) 2002-01-02 EP disclosed
US-6103942-A SUITABLE FOR FORMING THIN LAYER SILICON STRUCTURES IN VARIOUS SEMICONDUCTOR DEVICES AND HIGH PURITY POLY- AND SINGLE CRYSTAL SILICON FOR A VARIETY OF APPLICATIONS; REACTION OF METALLURGICAL SILICON WITH ALCOHOL IN PRESENCE OF CATALYST MIDWEST RESEARCH INSTITUTE (US) 2000-08-15 US disclosed
US-3957683-A Paste-like mixtures containing a cross-linking agent and a condensation catalyst WACKER-CHEMIE GMBH (DT) 1976-05-18 US disclosed