SCHEMBL2513554

SCHEMBL2513554

O[Cu].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27771346 0.89
SCHEMBL433689 0.87
Hydrochloric Acid SCHEMBL27273054 0.75
SCHEMBL27857228 0.75
Hydrochloric Acid SCHEMBL27270078 0.75
Water SCHEMBL27878965 0.75
Hydrogen Peroxide SCHEMBL346821 0.58
Hydrogen Peroxide SCHEMBL1132457 0.58
Hydrogen Peroxide SCHEMBL348074 0.58
SCHEMBL153010 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8034403-B2 Method for forming copper distributing wires ULVAC, INC. (JP) 2011-10-11 US disclosed