⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27663811 | 0.87 | — | — | |
| SCHEMBL5492044 | 0.87 | — | — | |
| SCHEMBL28002212 | 0.87 | — | — | |
| SCHEMBL28300053 | 0.87 | — | — | |
| SCHEMBL1508941 | 0.87 | — | — | |
| SCHEMBL27296274 | 0.87 | — | — | |
| SCHEMBL2531334 | 0.87 | — | — | |
| SCHEMBL5532049 | 0.87 | — | — | |
| SCHEMBL264666 | 0.87 | — | — | |
| SCHEMBL901165 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025229143-A1 | METHOD FOR PREPARING A CATALYST COMPOSITION | AVANTIUM KNOWLEDGE CENTRE B.V. (NL) | 2025-11-06 | — | — | WO | claimed |
| CN-118895109-A | Thermal interface material and preparation method thereof | 深圳先进电子材料国际创新研究院 | 2024-11-05 | — | — | CN | claimed |
| US-20260150750-A1 | ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | ACER INCORPORATED (TW) | 2026-05-28 | — | — | US | disclosed |
| US-20260150682-A1 | ELECTRONIC PACKAGE STRUCTURE MANUFACTURING METHOD THEREOF | ACER INCORPORATED (TW) | 2026-05-28 | — | — | US | disclosed |
| EP-4439656-B1 | SEMICONDUCTOR DEVICE | WINCHAIN MATERIAL TECH CO LTD (TW) | 2026-03-04 | — | — | EP | disclosed |
| EP-3472888-B1 | ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS | VARTA CONSUMER BATTERIES GMBH & CO KGAA (DE) | 2026-03-04 | — | — | EP | disclosed |
| WO-2025229143-A1 | METHOD FOR PREPARING A CATALYST COMPOSITION | AVANTIUM KNOWLEDGE CENTRE B.V. (NL) | 2025-11-06 | — | — | WO | disclosed |
| US-20250309239-A1 | ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS | ENERGIZER BRANDS, LLC | 2025-10-02 | — | — | US | disclosed |
| US-12341186-B2 | Alkaline electrochemical cell with improved anode and separator components | ENERGIZER BRANDS, LLC (US) | 2025-06-24 | — | — | US | disclosed |
| EP-4571828-A2 | SEMICONDUCTOR DEVICE | Morningrich Technology Co., Ltd. (TW) | 2025-06-18 | — | — | EP | disclosed |
| CN-119560468-A | Packaging heat radiation structure for large-size high-power artificial intelligent chip | 南京大学 | 2025-03-04 | — | — | CN | disclosed |
| WO-2011127480-A1 | MECHANICALLY PLATED PELLETS AND METHOD OF MANUFACTURE | ADVANCED LIGHTING TECHNOLOGIES, INC. (US) | 2011-10-13 | — | — | WO | disclosed |
| US-20110250455-A1 | MECHANICALLY PLATED PELLETS AND METHOD OF MANUFACTURE | EPIC DESIGN SERVICES GROUP, INC. | 2011-10-13 | — | — | US | disclosed |
| US-20100037990-A1 | BULK METALLIC GLASS SOLDER MATERIAL | SUH DAEWOONG | 2010-02-18 | — | — | US | disclosed |
| US-7628871-B2 | Solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes; BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric materials; ex: tin-indium | INTEL CORPORATION (US) | 2009-12-08 | — | — | US | disclosed |
| CN-101282817-A | Bulk metallic glass solder | INTEL CORP (US) | 2008-10-08 | — | — | CN | disclosed |
| EP-1539411-B1 | USE IN ELECTROCHEMICAL CELLS OF A ZINC POWDER | NORANDA INC (CA) | 2007-04-18 | — | — | EP | disclosed |
| WO-2007021492-A1 | BULK METALLIC GLASS SOLDER | INTEL CORPORATION (US) | 2007-02-22 | — | — | WO | disclosed |
| US-20070034305-A1 | Solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes; BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric materials; ex: tin-indium | INTEL CORPORATION | 2007-02-15 | — | — | US | disclosed |
| US-20040115532-A1 | Zinc powders for use in electrochemical cells | NORANDA INC. (CA) | 2004-06-17 | — | — | US | disclosed |