SCHEMBL25189065

SCHEMBL25189065

CC(Cc1ccccc1CC(C)c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ TAAR1 Q96RJ0 3/20 0.43
▸ GRIA4 P48058 1/20 0.40
▸ AOC3 Q16853 2/20 0.39
▸ ESR1 P03372 1/20 0.39
▸ ESR2 Q92731 1/20 0.39
▸ NPC1 O15118 1/20 0.36
▸ RAB9A P51151 1/20 0.36
▸ MAOA P21397 4/20 0.35
▸ MAOB P27338 4/20 0.35
▸ NISCH Q9Y2I1 3/20 0.35
▸ TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9223766 0.90 TAAR1 (0.39) TAAR1GRIA4AOC3ESR1ESR2
SCHEMBL8583523 0.82 TAAR1 (0.52) TAAR1ESR1ESR2NPC1RAB9A
SCHEMBL2472270 0.79 ESR1 (0.64) TAAR1ESR1ESR2TSHR
SCHEMBL30394315 0.79 ESR1 (0.64) TAAR1ESR1ESR2TSHR
SCHEMBL311572 0.78 ESR1 (0.63) TAAR1GRIA4ESR1ESR2TSHR
SCHEMBL5949977 0.78 ESR1 (0.63) TAAR1GRIA4ESR1ESR2TSHR
SCHEMBL1100456 0.78 ESR1 (0.63) TAAR1GRIA4ESR1ESR2TSHR
SCHEMBL8732205 0.78 TAAR1 (0.52) TAAR1AOC3ESR1ESR2NPC1
SCHEMBL23583472 0.77 TAAR1 (0.56) TAAR1AOC3
SCHEMBL1100434 0.76 ESR1 (0.46) TAAR1GRIA4ESR1ESR2MAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023090363-A1 RESIN COMPOSITION, CURED OBJECT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD 株式会社レゾナック 2023-05-25 — — WO disclosed
CN-105518060-B Fiber-reinforced resin and its manufacturing method and molded product 大赛璐赢创株式会社 2019-10-22 — — CN disclosed
CN-109789689-A Polyimide film, copper sheet laminated plate, and circuit board 日铁化学材料株式会社 2019-05-21 — — CN disclosed
CN-109642027-A Curable resin composition, cured product, adhesive film, cover film, flexible copper-clad laminate, and circuit board 积水化学工业株式会社 2019-04-16 — — CN disclosed
CN-109572104-A Metal-clad and circuit substrate 日铁化学材料株式会社 2019-04-05 — — CN disclosed
CN-109575283-A Polyimide film, metal-clad and circuit substrate 日铁化学材料株式会社 2019-04-05 — — CN disclosed
CN-109476901-A Resin composition, support with resin layer, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 日立化成株式会社 2019-03-15 — — CN disclosed
CN-109476923-A Resin composition, laminate, and multilayer printed wiring board 日立化成株式会社 2019-03-15 — — CN disclosed
CN-109415509-A Curable resin composition, adhesive, imide oligomer composition, and curing agent 积水化学工业株式会社 2019-03-01 — — CN disclosed
CN-109415551-A Resin composition, resin film, laminate, multilayer printed wiring board, and method for producing multilayer printed wiring board 日立化成株式会社 2019-03-01 — — CN disclosed
CN-108464060-A Multilayer transmission wiring board 日立化成株式会社 2018-08-28 — — CN disclosed
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