SCHEMBL25190482

SCHEMBL25190482

[SiH3][SiH2][SiH2]CCCS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5897422 0.73
SCHEMBL180662 0.61
SCHEMBL556639 0.61
SCHEMBL2970730 0.60
SCHEMBL9719065 0.60
SCHEMBL3790525 0.60
SCHEMBL9719073 0.60
SCHEMBL5167782 0.60
SCHEMBL63211 0.57
SCHEMBL25497 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108883946-B Zirconia nanoparticles 株式会社日本触媒 2024-05-10 CN disclosed
WO-2023166996-A1 ADHESIVE AGENT, LAMINATE, LAMINATE MANUFACTURING METHOD, AND PACKAGING MATERIAL DIC株式会社 2023-09-07 WO disclosed
WO-2023112688-A1 ADHESIVE, LAMINATE, AND PACKAGING MATERIAL DIC株式会社 2023-06-22 WO disclosed
WO-2023112687-A1 TWO-PACK CURABLE COATING AGENT, LAYERED BODY, AND PACKAGING MATERIAL DIC株式会社 2023-06-22 WO disclosed
WO-2023106097-A1 REACTIVE ADHESIVE, LAMINATED FILM, AND PACKAGING DIC株式会社 2023-06-15 WO disclosed
WO-2023106186-A1 ADHESIVE, MULTILAYER BODY AND PACKAGING MATERIAL DIC株式会社 2023-06-15 WO disclosed
WO-2023106191-A1 ADHESIVE AGENT, LAMINATE, LAMINATE MANUFACTURING METHOD, AND PACKAGING MATERIAL DIC株式会社 2023-06-15 WO disclosed
WO-2023085103-A1 ADHESIVE, LAMINATE, AND PACKAGING MATERIAL DIC株式会社 2023-05-19 WO disclosed