SCHEMBL2520071

SCHEMBL2520071

CCCc1c(S(=O)(=O)O)c(S(=O)(=O)O)c2ccccc2c1CCC

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.41
ALDH1A1 P00352 4/20 0.41
HPGD P15428 4/20 0.41
GAA P10253 1/20 0.41
RAB9A P51151 1/20 0.37
CYP1A2 P05177 1/20 0.36
GLA P06280 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36
TSHR P16473 2/20 0.36
NCEH1 Q6PIU2 1/20 0.35
SLC2A1 P11166 2/20 0.35
PPARG P37231 2/20 0.34
AGTR1 P30556 1/20 0.34
CYP2D6 P10635 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32
CFTR P13569 1/20 0.32
HSD17B10 Q99714 1/20 0.32
POLB P06746 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11523759 0.98 KDM4E (0.40) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL2519819 0.93 KDM4E (0.41) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL7779121 0.93 KDM4E (0.41) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL7783760 0.91 KDM4E (0.43) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL2519080 0.90 KDM4E (0.42) KDM4EALDH1A1HPGDGAARAB9A
Formaldehyde SCHEMBL19137749 0.90 KDM4E (0.39) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL11787246 0.89 KDM4E (0.41) KDM4EALDH1A1HPGDGAARAB9A
SCHEMBL1938340 0.87 KDM4E (0.45) KDM4EALDH1A1HPGDGAASLC2A1
SCHEMBL1036323 0.87 KDM4E (0.45) KDM4EALDH1A1HPGDGAASLC2A1
SCHEMBL6535752 0.87 KDM4E (0.45) KDM4EALDH1A1HPGDGAASLC2A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2671903-A1 METHOD FOR PRODUCING RESIN FILM USING ELECTROCONDUCTIVE RESIN COMPOSITION Nitto Denko Corporation (JP) 2013-12-11 EP disclosed
US-20130320268-A1 METHOD FOR PRODUCING RESIN FILM USING ELECTROCONDUCTIVE RESIN COMPOSITION NITTO DENKO CORPORATION (JP) 2013-12-05 US disclosed
CN-103339169-A Method for producing resin film using electroconductive resin composition NITTO DENKO CORP 2013-10-02 CN disclosed
US-8039057-B2 Forming a polyimide compound containing a polymeric conductive agent into a film shape; exposing the film to high temperature and humidity FUJI XEROX CO., LTD. (JP) 2011-10-18 US disclosed
US-7593676-B2 Image-forming apparatus with improved intermediate transfer body FUJI XEROX CO., LTD. (JP) 2009-09-22 US disclosed
US-20080280226-A1 Polyimide film, image-forming apparatus, method for producing the polyimide film, and method for producing the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2008-11-13 US disclosed
US-20080107457-A1 Image-forming apparatus FUJI XEROX CO., LTD. (JP) 2008-05-08 US disclosed
US-20070025740-A1 Intermediate transfer belt, production method thereof, and image-forming device using the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2007-02-01 US disclosed
US-20050214554-A1 Polyimide film, image-forming apparatus, method for producing the polyimide film, and method for producing the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2005-09-29 US disclosed
US-5436796-A Polyaniline in undoped state, second polymer having ester or amide groups, protonic acid NITTO DENKO CORPORATION (JP) 1995-07-25 US disclosed