⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7602 | 0.78 | — | — | |
| SCHEMBL17035901 | 0.78 | — | — | |
| SCHEMBL64958 | 0.78 | — | — | |
| SCHEMBL3915773 | 0.76 | — | — | |
| SCHEMBL825624 | 0.76 | — | — | |
| Fluoride SCHEMBL23673680 | 0.72 | — | — | |
| Iodide SCHEMBL1198681 | 0.72 | — | — | |
| Fluoride SCHEMBL21834012 | 0.72 | — | — | |
| Water SCHEMBL8946260 | 0.72 | — | — | |
| Ammonia Solution, Strong SCHEMBL11136564 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8586660-B2 | Dielectric paste composition, method of forming dielectric layer, dielectric layer, and device including the dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-11-19 | — | — | US | disclosed |
| EP-2378526-B1 | Dielectric paste composition, method of forming dielectric layer, dielectric layer, and device including the dielectric layer | SAMSUNG ELECTRONICS CO LTD (KR) | 2013-03-13 | — | — | EP | disclosed |
| EP-2378526-A1 | Dielectric paste composition, method of forming dielectric layer, dielectric layer, and device including the dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-10-19 | — | — | EP | disclosed |
| US-20110251319-A1 | DIELECTRIC PASTE COMPOSITION, METHOD OF FORMING DIELECTRIC LAYER, DIELECTRIC LAYER, AND DEVICE INCLUDING THE DIELECTRIC LAYER | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-10-13 | — | — | US | disclosed |