SCHEMBL25256751

SCHEMBL25256751

CC(C)=C(C)C(=O)O.CC(C)=C(C)C(=O)OCC(C)C

nearest known ligand 0.53

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.53
ALDH1A1 P00352 2/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.31
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20061887 0.92 TSHR (0.61) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL10010574 0.83 TSHR (0.67) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL10010571 0.83 TSHR (0.67) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL5314281 0.78 TSHR (0.60) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL6665498 0.77 TSHR (0.48) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL27742350 0.76 TSHR (0.58) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL25873502 0.75 TSHR (0.42) TSHR
SCHEMBL28881742 0.75 TSHR (0.57) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL21612742 0.75 TSHR (0.57) TSHRALDH1A1RAB9ASMN1; SMN2TDP1
SCHEMBL29116297 0.75 TSHR (0.57) TSHRALDH1A1RAB9ASMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024042720-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHODS FOR PRODUCING SAME 株式会社レゾナック 2024-02-29 WO disclosed
WO-2024034464-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREFOR 株式会社レゾナック 2024-02-15 WO disclosed
WO-2024029404-A1 ANTIVIRAL RESIN MATERIAL, METHOD FOR PRODUCING ANTIVIRAL RESIN MOLDED ARTICLE, AND ANTIVIRAL RESIN MOLDED ARTICLE 積水化学工業株式会社 2024-02-08 WO disclosed
WO-2023127794-A1 DENTAL CURABLE COMPOSITION AND DENTAL PROSTHESIS COMPRISING BASE MATERIAL AND RESIN LAYER クラレノリタケデンタル株式会社 2023-07-06 WO disclosed
WO-2023106410-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME 株式会社レゾナック 2023-06-15 WO disclosed
WO-2023106400-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR 株式会社レゾナック 2023-06-15 WO disclosed