⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL153504 | 0.97 | — | — | |
| SCHEMBL2917398 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL15662910 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL10945722 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL21611875 | 0.94 | — | — | |
| SCHEMBL21611856 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL6591537 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL4453137 | 0.94 | — | — | |
| SCHEMBL21611861 | 0.94 | TSHR (0.50) | — | |
| SCHEMBL10585608 | 0.94 | TSHR (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 158 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115244456-B | Sealing agent for display element, vertically conductive material, and display element | 积水化学工业株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-112840267-B | Sealing agent for display element, cured product, vertically conductive material, and display element | 积水化学工业株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114213333-B | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-113168055-B | Sealing agent for display element, cured product, vertically conductive material, and display element | 积水化学工业株式会社 | 2024-06-21 | — | — | CN | disclosed |
| EP-3998252-B1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEM (JP) | 2024-04-24 | — | — | EP | disclosed |
| CN-113248952-B | Ultraviolet curable resin composition, optical member and method for producing same, light-emitting device and method for producing same | 松下知识产权经营株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-111247141-B | Epoxy-oxetane compound, method for synthesizing the same, and use of the compound | 四国化成工业株式会社 | 2023-12-29 | — | — | CN | disclosed |
| US-11807596-B2 | Thiol compounds, synthesis method therefor, and utilization of said thiol compounds | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| US-11773207-B2 | Thiol compound, method for synthesizing same, and uses for said thiol compound | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-10-03 | — | — | US | disclosed |
| CN-116478355-A | Benzoxazine resin material for preparing three-dimensional object and using method thereof | 清锋（北京）科技有限公司 | 2023-07-25 | — | — | CN | disclosed |
| US-20050249941-A1 | Antireflection film and object having undergone antireflection treatment | TDK CORPORATION (JP) | 2005-11-10 | — | — | US | disclosed |
| US-20050244633-A1 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets | NITTO DENKO CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1591506-A1 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets | Nitto Denko Corporation (JP) | 2005-11-02 | — | — | EP | disclosed |
| EP-1582573-A2 | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film | Nitto Denko Corporation (JP) | 2005-10-05 | — | — | EP | disclosed |
| CN-1667071-A | Adhesive composition, adhesive sheets and surface protective film | NITTO DENKO CORP (JP) | 2005-09-14 | — | — | CN | disclosed |
| US-20050197450-A1 | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film | NITTO DENKO CORPORATION (JP) | 2005-09-08 | — | — | US | disclosed |
| US-20040053061-A1 | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-03-18 | — | — | US | disclosed |
| CN-1479768-A | Material for insulating substrate, printed wiring board, laminate, resin-coated copper foil, copper-clad laminate, polyimide film, film for T ab, and semi-solid sheet | ��Ԩ��ѧ��ҵ��ʽ���� | 2004-03-03 | — | — | CN | disclosed |
| EP-1350815-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2003-10-08 | — | — | EP | disclosed |
| CN-1381756-A | Adhesive sheet, layered sheet and liquid crystal display unit | SHARP KK (JP) | 2002-11-27 | — | — | CN | disclosed |