SCHEMBL253698

SCHEMBL253698

CC1CCCC2=C1C(=O)OC2=O

nearest known ligand 0.43

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.43
CA2 P00918 1/20 0.43
CA4 P22748 1/20 0.43
KMT2A Q03164 1/20 0.42
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8619667 0.88 CA1 (0.37) CA1CA2CA4KMT2ACA9
SCHEMBL181912 0.76 SMN1; SMN2 (0.35) CA1CA2CA4KMT2A
SCHEMBL8620496 0.76
SCHEMBL8623224 0.76 TP53 (0.32)
SCHEMBL18659265 0.73 CA1 (0.45) CA1CA2CA4KMT2ACA9
SCHEMBL40325 0.72 TRIM24 (0.39) CA1CA9
SCHEMBL10439640 0.72 CA1 (0.30) CA1CA2CA4CA9
SCHEMBL9412781 0.72 MCL1 (0.38)
SCHEMBL8622843 0.71
SCHEMBL6666733 0.70 TRIM24 (0.42) CA1CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 713 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12435237-B2 UV resistant surfacing materials for composite parts CYTEC INDUSTRIES INC. (US) 2025-10-07 US claimed
CN-117736626-B Metal-enclosed insulated wire and production process thereof 扬州市鑫源电气股份有限公司 2024-06-21 CN claimed
CN-117736626-A Metal-enclosed insulated wire and production process thereof 扬州市鑫源电气股份有限公司 2024-03-22 CN claimed
EP-4081597-B1 UV RESISTANT SURFACING MATERIALS FOR COMPOSITE PARTS CYTEC IND INC (US) 2023-10-11 EP claimed
US-20230114308-A1 Flux-Compatible Epoxy-Anhydride Adhesives Compositions for Low-Gap Underfill Applications HENKEL AG & CO KGAA (DE) 2023-04-13 US claimed
US-20230091593-A1 UV RESISTANT SURFACING MATERIALS FOR COMPOSITE PARTS CYTEC INDUSTRIES INC. 2023-03-23 US claimed
CN-115715313-A Flux compatible epoxy-anhydride adhesive compositions for low gap underfill applications 汉高股份有限及两合公司 2023-02-24 CN claimed
EP-4081597-A1 UV RESISTANT SURFACING MATERIALS FOR COMPOSITE PARTS Cytec Industries, Inc. (US) 2022-11-02 EP claimed
WO-2021133972-A1 UV RESISTANT SURFACING MATERIALS FOR COMPOSITE PARTS CYTEC INDUSTRIES INC. (US) 2021-07-01 WO claimed
CN-112980140-A Nano-cellulose and epoxy resin composite material with excellent electrical properties and preparation method thereof 华北电力大学 2021-06-18 CN claimed
US-20020032280-A1 No-flow flux adhesive compositions 3M INNOVATIVE PROPERTIES COMPANY 2002-03-14 US claimed
WO-2002004541-A2 NO-FLOW FLUX ADHESIVE COMPOSITIONS 3M INNOVATIVE PROPERTIES COMPANY (US) 2002-01-17 WO claimed
EP-1062545-A1 POSITIVE ACTING PHOTODIELECTRIC COMPOSITION Isola Laminate Systems Corporation (US) 2000-12-27 EP claimed
EP-0976307-A1 POSITIVE WORKING PHOTODEFINABLE RESIN COATED METAL FOR MASS PRODUCTION OF MICROVIAS IN MULTILAYER PRINTED WIRING BOARDS AlliedSignal Inc. (US) 2000-02-02 EP claimed
WO-1999041642-A1 POSITIVE ACTING PHOTODIELECTRIC COMPOSITION ISOLA LAMINATE SYSTEMS CORPORATION (US) 1999-08-19 WO claimed
WO-1998047332-A1 POSITIVE WORKING PHOTODEFINABLE RESIN COATED METAL FOR MASS PRODUCTION OF MICROVIAS IN MULTILAYER PRINTED WIRING BOARDS ALLIEDSIGNAL INC. (US) 1998-10-22 WO claimed
US-5614594-A POLYGLYCIDYL METHACRYLATE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1997-03-25 US claimed
EP-0353089-B1 Thermosetting epoxy resin composition TONEN CORP (JP) 1994-12-21 EP claimed
EP-0259265-B1 3-METHYL PHTHALIMIDES CIBA-GEIGY AG (CH) 1991-09-11 EP claimed
EP-0259265-A1 3-Methyl phthalimides CIBA-GEIGY AG (CH) 1988-03-09 EP claimed