SCHEMBL25416705

SCHEMBL25416705

CCCCCCCCCCCCn1cc(Cl)c(C)n1

nearest known ligand 0.45

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
KDR P35968 5/20 0.45
SMPD1 P17405 4/20 0.38
KDM4E B2RXH2 1/20 0.36
LMNA P02545 1/20 0.36
PTGS1 P23219 3/20 0.35
PTGS2 P35354 3/20 0.35
MGLL Q99685 2/20 0.35
FAAH O00519 1/20 0.35
GBA1 P04062 4/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17943862 1.00 KDR (0.45) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL25414997 1.00 KDR (0.45) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL8848856 1.00 KDR (0.45) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL25416277 1.00 KDR (0.45) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL17943854 0.98 KDR (0.43) KDRSMPD1KDM4ELMNA
SCHEMBL25416261 0.81 KDR (0.44) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL25413523 0.81 KDR (0.44) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL25415712 0.81 KDR (0.44) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL25414778 0.81 KDR (0.44) KDRSMPD1KDM4ELMNAPTGS1
SCHEMBL7134464 0.79 KDR (0.45) KDRSMPD1PTGS1PTGS2MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250154410-A1 COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-15 US disclosed
EP-4485506-A1 COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-01-01 EP disclosed
CN-118715596-A Composition, and method for manufacturing and etching semiconductor substrate using same 三菱瓦斯化学株式会社 2024-09-27 CN disclosed
WO-2023163002-A1 COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME 三菱瓦斯化学株式会社 2023-08-31 WO disclosed