SCHEMBL254346

SCHEMBL254346

O=C(O)c1ccc(CCCc2ccc(C(=O)O)c(C(=O)O)c2)cc1C(=O)O

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KAT8 Q9H7Z6 2/20 0.54
PPARA Q07869 2/20 0.54
LCK P06239 2/20 0.53
PPARG P37231 1/20 0.50
KLKB1 P03952 1/20 0.48
CTSB P07858 1/20 0.48
MMP9 P14780 1/20 0.48
DNMT1 P26358 1/20 0.48
DNMT3B Q9UBC3 1/20 0.48
DNMT3L Q9UJW3 1/20 0.48
DNMT3A Q9Y6K1 1/20 0.48
CDC25B P30305 2/20 0.47
ALDH1A1 P00352 2/20 0.47
CASP6 P55212 1/20 0.47
RCE1 Q9Y256 1/20 0.47
EGFR P00533 1/20 0.46
RARB P10826 3/20 0.45
RARA P10276 1/20 0.45
RARG P13631 1/20 0.45
METAP2 P50579 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2687820 0.94 KAT8 (0.62) KAT8PPARALCKPPARGKLKB1
SCHEMBL8159417 0.94 KAT8 (0.62) KAT8PPARALCKPPARGKLKB1
SCHEMBL7071495 0.92 HDAC1 (0.50) KAT8PPARALCKCDC25BALDH1A1
SCHEMBL23103 0.91 LCK (0.62) KAT8PPARALCKPPARGKLKB1
SCHEMBL29404777 0.91 LCK (0.62) KAT8PPARALCKPPARGKLKB1
SCHEMBL28265275 0.90 PPARA (0.50) KAT8PPARALCKPPARGKLKB1
SCHEMBL1356365 0.88 KAT8 (0.66) KAT8PPARAPPARGALDH1A1RARB
SCHEMBL7853570 0.88 KAT8 (0.49) KAT8PPARALCKPPARGKLKB1
SCHEMBL16543610 0.88 KAT8 (0.49) KAT8PPARALCKPPARGKLKB1
SCHEMBL9669766 0.87 KAT8 (0.51) KAT8PPARALCKPPARGKLKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 217 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022265394-A1 BUFFER COMPOSITE SHEET COMPRISING POLYMER FOAM AND POLYIMIDE AND METHOD FOR MANUFACTURING SAME 피아이첨단소재 주식회사 2022-12-22 WO claimed
WO-2022228449-A1 PREPARATION METHOD FOR POLYIMIDE RESIN AND THIN FILM THEREOF 上海瑞暨新材料科技有限公司 2022-11-03 WO claimed
US-7416695-B2 Semiconductive polymide film and process for production thereof KANEKA CORPORATION (JP) 2008-08-26 US claimed
US-6251990-B1 BLEND CONTAINING ORGANOPOLYSILOXANE, ALUMINUM HYDROXIDE, CATALYST, THIXOTROPIC AGENT AND TACKIFIER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-06-26 US claimed
EP-0356172-A2 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-28 EP claimed
EP-3496111-B1 ROTARY CHARGE STRIPPING FILM IN CHARGE STRIPPING DEVICE OF ION BEAM AND CHARGE STRIPPING METHOD OF ION BEAM KANEKA CORP (JP) 2026-05-06 EP disclosed
US-12365593-B2 Method for preparing graphite film KANEKA CORPORATION (JP) 2025-07-22 US disclosed
US-12305017-B2 Graphite sheet and electronic device comprising same PI ADVANCED MATERIALS CO., LTD. (KR) 2025-05-20 US disclosed
WO-2025057653-A1 METHOD FOR MANUFACTURING ELECTROCONDUCTIVE FILM, TOUCH PANEL, AND DISPLAY PANEL JSR株式会社 2025-03-20 WO disclosed
WO-2025033304-A1 METHOD FOR MANUFACTURING LIQUID CRYSTAL ALIGNMENT FILM, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-02-13 WO disclosed
EP-3764160-B1 PELLICLE INCLUDING GRAPHITE FILM KANEKA CORP (JP) 2024-10-23 EP disclosed
WO-2024209869-A1 LAMINATE AND METHOD FOR MANUFACTURING CIRCUIT BOARD 株式会社有沢製作所 2024-10-10 WO disclosed
EP-0500026-A1 Compounds, monomers, and polymers based on perfluoroalkyl and perfluoroalkyl-aryl dioxapentacene E.I. DU PONT DE NEMOURS AND COMPANY (US) 1992-08-26 EP disclosed
EP-0418889-A2 Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof Toho Rayon Co., Ltd. (JP) 1991-03-27 EP disclosed
EP-0399558-A2 Process for forming end-capped polyamic acids polyimides ETHYL CORPORATION (US) 1990-11-28 EP disclosed
EP-0393638-A2 Thermosetting resin compostion and thermosetting dry film UBE INDUSTRIES, LTD. (JP) 1990-10-24 EP disclosed
US-4956450-A CONDENSATION OF DIAMINE WITH POLYCARBOXYLIC ACIDS TO FORM POLYIMIDES ETHYL CORPORATION (US) 1990-09-11 US disclosed
EP-0356172-A2 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-28 EP disclosed
US-4742153-A HEATING DIAMINE, DICARBOXYLATED MONOANHYDRIDE, AND DICARBOXYLATED DIANHYDRIDE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1988-05-03 US disclosed
US-4214071-A Amide-imide polymers WESTINGHOUSE ELECTRIC CORP. (US) 1980-07-22 US disclosed