SCHEMBL25453048

SCHEMBL25453048

CC(C)(CC(C)(C)OCC(O)COC(C)(C)c1ccc(C(C)(C)c2ccc(O)cc2)cc1)OCC(O)COc1ccc(C(C)(C)c2ccc(C(C)(C)O)cc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTT P42858 1/20 0.46
▸ HIF1A Q16665 1/20 0.46
▸ AR P10275 3/20 0.45
▸ KMT2A Q03164 2/20 0.40
▸ SLC6A2 P23975 2/20 0.40
▸ PTGS1 P23219 1/20 0.40
▸ MEN1 O00255 1/20 0.38
▸ ADRB3 P13945 5/20 0.38
▸ ADRB2 P07550 4/20 0.38
▸ ADRB1 P08588 4/20 0.38
▸ ESR1 P03372 1/20 0.36
▸ CYP3A4 P08684 1/20 0.36
▸ HPGD P15428 1/20 0.36
▸ TSHR P16473 1/20 0.36
▸ SLC6A4 P31645 1/20 0.36
▸ HTR6 P50406 1/20 0.36
▸ ESRRG P62508 1/20 0.36
▸ SLC6A3 Q01959 1/20 0.36
▸ ESR2 Q92731 1/20 0.36
▸ HSD17B10 Q99714 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13567688 0.81 HTT (0.65) HTTHIF1AARKMT2ASLC6A2
SCHEMBL21779296 0.80 HTT (0.57) HTTHIF1AARKMT2AMEN1
SCHEMBL26862685 0.76 AR (0.74) HTTHIF1AARKMT2ASLC6A2
SCHEMBL12726584 0.76 HTT (0.58) HTTHIF1AARKMT2ASLC6A2
SCHEMBL15501759 0.76 HTT (0.58) HTTHIF1AARKMT2ASLC6A2
SCHEMBL24900896 0.76 KMT2A (0.59) HTTHIF1AARKMT2ASLC6A2
SCHEMBL17694782 0.76 HTT (0.58) HTTHIF1AARKMT2ASLC6A2
SCHEMBL18821922 0.76 HTT (0.58) HTTHIF1AARKMT2ASLC6A2
SCHEMBL25688278 0.75 HTT (0.57) HTTHIF1AARKMT2ASLC6A2
SCHEMBL16226561 0.75 AR (0.76) HTTHIF1AARKMT2ASLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023223923-A1 HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT DIC株式会社 2023-11-23 — — WO disclosed
WO-2023079966-A1 CROSSLINKABLE RESIN COMPOSITION AND CURED ARTICLE DIC株式会社 2023-05-11 — — WO disclosed
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