SCHEMBL25797703

SCHEMBL25797703

Oc1cc(OCCCCCCCCCCCC(F)(F)F)ccc1OC(F)(F)F

nearest known ligand 0.43

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
▸ MAOB P27338 3/20 0.43
▸ NR5A1 Q13285 1/20 0.41
▸ APP P05067 2/20 0.39
▸ SCN8A Q9UQD0 1/20 0.39
▸ SCN10A Q9Y5Y9 1/20 0.39
▸ FFAR4 Q5NUL3 1/20 0.37
▸ KCNH2 Q12809 1/20 0.36
▸ LTA4H P09960 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25797928 0.93 NR5A1 (0.42) MAOBNR5A1FFAR4
SCHEMBL26331510 0.87 PDK2 (0.46) NR5A1FFAR4
SCHEMBL25797649 0.87 PDK2 (0.46) NR5A1FFAR4
SCHEMBL25798486 0.86 NR5A1 (0.41) MAOBNR5A1FFAR4
SCHEMBL25797620 0.86 NR5A1 (0.55) NR5A1LTA4H
SCHEMBL26548198 0.84 FFAR4 (0.40) MAOBNR5A1FFAR4
SCHEMBL25797920 0.80 APP (0.46) NR5A1APPFFAR4
SCHEMBL25797846 0.80 APP (0.46) NR5A1APPFFAR4
SCHEMBL26331265 0.78 MAOB (0.47) MAOBNR5A1KCNH2
SCHEMBL27436750 0.75 MAOB (0.47) MAOBNR5A1KCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4249461-A1 PHENOL COMPOUND, ELECTROCONDUCTIVE PASTE COMPOSITION, METHOD FOR PRODUCING ELECTROCONDUCTIVE PASTE COMPOSITION, AND ELECTROCONDUCTIVE WIRING LINE AND PRODUCTION METHOD THEREFOR SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-27 — — EP disclosed
WO-2023145438-A1 THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 信越化学工業株式会社 2023-08-03 — — WO disclosed
EP-4194434-A1 POLYURETHANE, METHOD FOR PRODUCING POLYURETHANE, ELECTROCONDUCTIVE PASTE COMPOSITION, ELECTROCONDUCTIVE WIRE, AND METHOD FOR PRODUCING ELECTROCONDUCTIVE WIRE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-14 — — EP disclosed
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