⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2878242 | 0.82 | — | — | |
| SCHEMBL1132561 | 0.81 | — | — | |
| SCHEMBL9301985 | 0.81 | — | — | |
| SCHEMBL2579548 | 0.81 | — | — | |
| SCHEMBL11585004 | 0.78 | TDP1 (0.30) | — | |
| SCHEMBL4553059 | 0.78 | — | — | |
| SCHEMBL2968042 | 0.77 | — | — | |
| SCHEMBL615160 | 0.73 | — | — | |
| SCHEMBL9301687 | 0.73 | — | — | |
| SCHEMBL9302735 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105934478-B | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | 日立化成株式会社 | 2020-01-14 | — | — | CN | claimed |
| US-9927396-B2 | Capillary electrophoresis-electrospray ionization-mass spectrometry system | DH TECHNOLOGIES DEVELOPMENT PTE. LTD. (SG) | 2018-03-27 | — | — | US | claimed |
| US-9464191-B2 | Silicon-containing curing composition and cured product thereof | ADEKA CORPORATION (JP) | 2016-10-11 | — | — | US | claimed |
| US-8617693-B2 | Antireflection laminate | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-12-31 | — | — | US | claimed |
| US-8492496-B2 | Copolymers of nanoparticles, vinyl monomers and silicone | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2013-07-23 | — | — | US | claimed |
| WO-2024202696-A1 | COMPOSITION, BLACK MATRIX, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND DISPLAY DEVICE | 株式会社ADEKA | 2024-10-03 | — | — | WO | disclosed |
| EP-3597670-B1 | WATER-SOLUBLE COMPOSITION, PRODUCTION METHOD FOR CURED PRODUCT THEREOF, AND CURED PRODUCT THEREOF, AND ACYL PHOSPHINATE | ADEKA CORP (JP) | 2024-07-10 | — | — | EP | disclosed |
| US-11649334-B2 | Water-soluble composition, production method for cured product thereof, and cured product thereof, and acyl phosphinate | ADEKA CORPORATION (JP) | 2023-05-16 | — | — | US | disclosed |
| CN-114995060-A | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | disclosed |
| CN-110114376-B | Curable composition, method for producing cured product, cured product thereof, and adhesive using same | 株式会社ADEKA | 2022-06-14 | — | — | CN | disclosed |
| CN-109476773-B | Curable composition, cured product, and method for producing cured product | 株式会社艾迪科 | 2022-05-13 | — | — | CN | disclosed |
| CN-114449997-A | Involving the use of C1-C6Process for colouring keratin materials with an organoalkoxysilane and an acidifying agent | 汉高股份有限及两合公司 | 2022-05-06 | — | — | CN | disclosed |
| US-5916963-A | ACRYLIC ESTERS WITH SILICON GROUPS | TOYO INK MANUFACTURING CO., LTD. (JP) | 1999-06-29 | — | — | US | disclosed |
| EP-0604079-B1 | Process for manufacture of abrasion resistant coatings for highly filled polyester compositions | GEN ELECTRIC (US) | 1998-03-18 | — | — | EP | disclosed |
| US-5494948-A | OBTAINED BY HEATING AND MELTING MIXTURE CONTAINING CRYSTALLINE POLYPROPYLENE, MICA TREATED WITH ORGANOSILANE COMPOUND, BISMALEIMIDE COMPOUND, ORGANIC PEROXIDE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1996-02-27 | — | — | US | disclosed |
| US-5346767-A | Siloxane coating for ceramic-like polyester moldings | GENERAL ELECTRIC COMPANY (US) | 1994-09-13 | — | — | US | disclosed |
| EP-0604079-A1 | Abrasion resistant highly filled polyester compositions | GENERAL ELECTRIC COMPANY (US) | 1994-06-29 | — | — | EP | disclosed |
| US-4431472-A | Method for improving the adhesion of organopolysiloxane elastomers | WACKER-CHEMIE GMBH (DE) | 1984-02-14 | — | — | US | disclosed |
| EP-0089066-A1 | Process for modifying the bonding of siloxane elastomer | Wacker-Chemie GmbH (DE) | 1983-09-21 | — | — | EP | disclosed |
| US-4081421-A | Curable resin composition for abrasion-resistant coating | JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JA) | 1978-03-28 | — | — | US | disclosed |