SCHEMBL25899331

SCHEMBL25899331

CC(C)(c1ccc(Oc2ccc3c(c2)C(=O)N(c2cccc(O)c2)C3=O)cc1)c1ccc(Oc2ccc3c(c2)C(=O)N(c2cccc(O)c2)C3=O)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 6/20 0.65
KMT2A Q03164 6/20 0.65
ALDH1A1 P00352 3/20 0.65
MAPT P10636 2/20 0.65
ESR1 P03372 4/20 0.59
BRD4 O60885 1/20 0.58
NPC1 O15118 1/20 0.53
RAB9A P51151 1/20 0.53
POLB P06746 2/20 0.53
MAPK1 P28482 1/20 0.53
PKM P14618 1/20 0.53
HTT P42858 1/20 0.49
KDM4E B2RXH2 1/20 0.49
NPSR1 Q6W5P4 1/20 0.47
LPAR1 Q92633 1/20 0.47
LPAR5 Q9H1C0 1/20 0.47
LPAR3 Q9UBY5 1/20 0.47
GAA P10253 2/20 0.44
ESR2 Q92731 1/20 0.43
HSD17B10 Q99714 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12231558 0.91 BRD4 (0.62) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL12231556 0.90 BRD4 (0.61) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL24149295 0.89 MEN1 (0.74) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL25550005 0.87 BRD4 (0.79) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL29339126 0.87 MEN1 (0.51) MEN1KMT2AALDH1A1MAPTBRD4
SCHEMBL1987721 0.86 BRD4 (0.70) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL9342244 0.86 BRD4 (0.54) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL20512991 0.85 KMT2A (0.74) MEN1KMT2AALDH1A1MAPTBRD4
SCHEMBL21881747 0.85 KMT2A (0.60) MEN1KMT2AALDH1A1MAPTESR1
SCHEMBL12731749 0.84 MEN1 (0.51) MEN1KMT2AALDH1A1MAPTBRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230236508-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2023-07-27 US disclosed
US-20230236508-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2023-07-27 US disclosed