Ethylene Glycol

Ethylene Glycol

SCHEMBL259159

O=C(O)C1CCC2OC2C1.O=C(O)C1CCC2OC2C1.OCCO

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TFPI2 P48307 4/20 0.45
LMNA P02545 2/20 0.45
KDM4E B2RXH2 1/20 0.45
GMNN O75496 1/20 0.45
PMP22 Q01453 1/20 0.45
TP53 P04637 1/20 0.45
TSHR P16473 1/20 0.45
NFKB1 P19838 1/20 0.45
THPO P40225 1/20 0.45
PLG P00747 1/20 0.36
PLAT P00750 1/20 0.36
ACE P12821 1/20 0.36
PPM1B O75688 3/20 0.36
PTPN1 P18031 3/20 0.36
PPP1CC P36873 3/20 0.36
AKR1C3 P42330 1/20 0.35
AKR1C1 Q04828 1/20 0.35
PPP5C P53041 2/20 0.34
PPP2CA P67775 1/20 0.34
NPY4R P50391 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene Glycol SCHEMBL6404800 1.00 TFPI2 (0.45) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL4098788 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL2184024 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL2184711 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL7263479 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL2726787 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL4109815 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL4948347 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL124941 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22
SCHEMBL4088843 0.92 TFPI2 (0.52) TFPI2LMNAKDM4EGMNNPMP22

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 274 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920008-B2 Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-02-16 US claimed
US-20200123307-A1 THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-04-23 US claimed
CN-110806676-A Photosensitive resin composition and application thereof 常州强力先端电子材料有限公司 2020-02-18 CN claimed
US-20140087207-A1 ARTICLES COMPRISING A WEATHER-RESISTANT ADHESIVE LAYER IN CONTACT WITH A LOW SURFACE-ENERGY MATERIAL DU PONT (US) 2014-03-27 US claimed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP claimed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP claimed
US-6262147-B1 AS TOP COATS TO AUTOMOBILES KANSAI PAINT CO., LTD. (JP) 2001-07-17 US claimed
US-6015848-A CURABLE MIXTURE OF ALICYCLIC EPOXY COMPOUND, EPOXY GROUP-CONTAINING ACRYLIC RESIN, CATIONIC POLYMERIZATION CATALYST, AND FLUOROPOLYMER KANSAI PAINT CO., LTD. (JP) 2000-01-18 US claimed
EP-0846739-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 1998-06-10 EP claimed
EP-0171356-B1 METHOD FOR POLYMERIZING CATIONICALLY POLYMERIZABLE COMPOUNDS CIBA-GEIGY AG (CH) 1987-11-04 EP claimed
US-20250348000-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-11-13 US disclosed
US-20240242854-A1 OXYGEN AND MOISTURE BARRIER COMPOSITIONS AND RELATED METHODS US GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE ARMY 2024-07-18 US disclosed
EP-4397623-A1 EPOXY GROUP-CONTAINING ORGANOSILICA SOL, EPOXY RESIN COMPOSITION AND PRODUCTION METHOD THEREOF Nissan Chemical Corporation (JP) 2024-07-10 EP disclosed
US-11961636-B2 Silica-containing insulating composition NISSAN CHEMICAL CORPORATION (JP) 2024-04-16 US disclosed
US-11857385-B2 Method of producing plate denture, curable composition for stereolithography, and plate denture production kit TOKUYAMA DENTAL CORPORATION (JP) 2024-01-02 US disclosed
US-4218279-A Bonding method employing film adhesives containing an epoxide resin CIBA-GEIGY CORPORATION (US) 1980-08-19 US disclosed
US-4115300-A DIEPOXIDES THE UPJOHN COMPANY (US) 1978-09-19 US disclosed
US-4043969-A Casting compound for semiconductor devices NATIONAL SEMICONDUCTOR CORPORATION (US) 1977-08-23 US disclosed
US-4038338-A NEW POLYEPOXIDE-POLYSILOXANE COMPOUNDS CIBA-GEIGY CORPORATION (US) 1977-07-26 US disclosed
US-3962182-A CHROMIUMIII CARBOXYLATE CATALYST AEROJET-GENERAL CORPORATION (US) 1976-06-08 US disclosed