SCHEMBL259201

SCHEMBL259201

O=C(OCC1CCC2OC2C1)C(=O)OCC1CCC2OC2C1

nearest known ligand 0.35

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 3/20 0.35
PTPN1 P18031 3/20 0.35
PPP1CC P36873 3/20 0.35
LMNA P02545 2/20 0.34
KDM4E B2RXH2 1/20 0.34
GMNN O75496 1/20 0.34
PMP22 Q01453 1/20 0.34
TFPI2 P48307 1/20 0.34
TP53 P04637 1/20 0.34
TSHR P16473 1/20 0.34
NFKB1 P19838 1/20 0.34
THPO P40225 1/20 0.34
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11029298 0.91 PPM1B (0.36) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL21919183 0.89 PPM1B (0.35) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL21919411 0.89 PPM1B (0.35) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL17012024 0.89 PPM1B (0.35) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL11760621 0.89 PPM1B (0.35) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL14154849 0.87 PTGS1 (0.32) LMNA
SCHEMBL23863984 0.87 PPM1B (0.34) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL21727479 0.87 PPM1B (0.38) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL23862869 0.87 PPM1B (0.34) PPM1BPTPN1PPP1CCLMNAKDM4E
SCHEMBL12669739 0.87 PPM1B (0.34) PPM1BPTPN1PPP1CCLMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 646 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12305077-B2 Matting agent including emulsion polymer particles, matting polymer composition including matting agent, and method of producing emulsion polymer particles HANNANOTECH CO., LTD. (KR) 2025-05-20 US claimed
EP-4545600-A1 CATIONIC PHOTOCURABLE COMPOSITION, PAINT, ARTICLE OF MANUFACTURE WITH PHOTOCURABLE COATING, AND INK Changzhou Zhengjie Intelligent Manufacture Technology Co., Ltd. (CN) 2025-04-30 EP claimed
CN-114729157-B Formulations with high glass transition temperature for laminates 汉高股份有限及两合公司 2025-04-25 CN claimed
US-12168737-B2 Matting agent including polymer particles, matting polymer composition including matting agent, and method of producing polymer particles HANNANOTECH CO., LTD. (KR) 2024-12-17 US claimed
CN-118955873-A Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems 赢创运营有限公司 2024-11-15 CN claimed
CN-111434704-B Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems 赢创运营有限公司 2024-10-18 CN claimed
US-12049539-B2 Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems EVONIK OPERATIONS GMBH (DE) 2024-07-30 US claimed
WO-2023246918-A1 CATIONIC PHOTOCURABLE COMPOSITION, PAINT, ARTICLE OF MANUFACTURE WITH PHOTOCURABLE COATING, AND INK 常州正洁智造科技有限公司 2023-12-28 WO claimed
CN-117285706-A Cationic photocurable composition, coating material, article having photocurable coating layer, and ink 常州正洁智造科技有限公司 2023-12-26 CN claimed
EP-3559077-B1 N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2023-12-06 EP claimed
EP-3680270-A1 MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS Evonik Operations GmbH (DE) 2020-07-15 EP claimed
CN-111061125-A Photoresist and application thereof 常州强力先端电子材料有限公司 2020-04-24 CN claimed
EP-3559077-A1 N-HYDXYL ETHYL PIPRIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS Evonik Degussa GmbH (DE) 2019-10-30 EP claimed
WO-2019170563-A1 CYCLOALIPHATIC AMINES FOR EPOXY FORMULATIONS: A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK DEGUSSA GMBH (DE) 2019-09-12 WO claimed
WO-2018118137-A1 N-HYDXYL ETHYL PIPRIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK DEGUSSA GMBH (DE) 2018-06-28 WO claimed
US-20180171067-A1 N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2018-06-21 US claimed
WO-2014197269-A1 METHODS OF USING AQUEOUS WELLBORE SERVICING COMPOSITIONS COMPRISING A RESIN AND AN ORGANOSILANE HALLIBURTON ENERGY SERVICES, INC. (US) 2014-12-11 WO claimed
US-20140357535-A1 Wellbore Servicing Compositions and Methods of Making and Using Same HALLIBURTON ENERGY SERVICES, INC. 2014-12-04 US claimed
US-20140087207-A1 ARTICLES COMPRISING A WEATHER-RESISTANT ADHESIVE LAYER IN CONTACT WITH A LOW SURFACE-ENERGY MATERIAL DU PONT (US) 2014-03-27 US claimed
US-6350344-B1 Solventless primers which are hardenable by radiation HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2002-02-26 US claimed