SCHEMBL25959871

SCHEMBL25959871

CC(C)(C)OCC(CC[SiH3])OC(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL755226 0.83 MAPK1 (0.48) MAPK1
SCHEMBL30549092 0.82 MAPK1 (0.39) MAPK1
SCHEMBL28296545 0.78 MAPK1 (0.37) MAPK1
SCHEMBL19543065 0.76 MAPK1 (0.42) MAPK1
SCHEMBL20995928 0.76 MAPK1 (0.42) MAPK1
SCHEMBL15760607 0.76 MAPK1 (0.42) MAPK1
SCHEMBL19543658 0.76 MAPK1 (0.42) MAPK1
SCHEMBL16368826 0.76 MAPK1 (0.42) MAPK1
SCHEMBL17085245 0.76 MAPK1 (0.42) MAPK1
SCHEMBL19543096 0.76 MAPK1 (0.42) MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230305405-A1 COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-20230244149-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-03 US disclosed