SCHEMBL26073683

SCHEMBL26073683

C1CC(C2(C3CCC4OC4C3)CCC3OC3C2)CC2OC12

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL556690 0.76 CYP19A1 (0.38) CYP19A1
SCHEMBL36696 0.71 TFPI2 (0.34) CYP19A1
SCHEMBL3369507 0.69 CYP19A1 (0.32) CYP19A1
SCHEMBL36353 0.61 KDM4E (0.44)
SCHEMBL14114631 0.61 MAPK1 (0.30)
SCHEMBL15813209 0.58 TFPI2 (0.33)
SCHEMBL14510049 0.58 TFPI2 (0.33)
SCHEMBL13784893 0.58 TFPI2 (0.33)
SCHEMBL658709 0.58 TFPI2 (0.33)
SCHEMBL509546 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230307407-A1 MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER RICOH COMPANY, LTD. (JP) 2023-09-28 US disclosed
US-20230307407-A1 MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER RICOH COMPANY, LTD. (JP) 2023-09-28 US disclosed