SCHEMBL261063

SCHEMBL261063

FC(F)=C1C[CH]CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18735437 0.68
SCHEMBL1578892 0.68
SCHEMBL1255385 0.66
SCHEMBL17141201 0.65
SCHEMBL3855766 0.61
SCHEMBL4888673 0.60
SCHEMBL1929903 0.60
SCHEMBL3231233 0.60
SCHEMBL3684469 0.60
SCHEMBL1927972 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 567 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115335464-B Hydrophobic coating composition 迈图高新材料公司 2024-03-26 CN disclosed
EP-4305116-A1 SILICON-BASED COMPOSITIONS AND APPLICATIONS THEREOF Momentive Performance Materials Inc. (US) 2024-01-17 EP disclosed
US-20240010786-A9 POLYOL COMPOSITIONS PRESIDIUM INNOVATIONS, LLC 2024-01-11 US disclosed
CN-113423767-B Curable silicone-based composition and use thereof 迈图高新材料公司 2024-01-09 CN disclosed
CN-117280004-A Silicon-based composition and use thereof 迈图高新材料公司 2023-12-22 CN disclosed
US-20230055656-A1 HYDROPHOBIC COATING COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-23 US disclosed
EP-4097180-A1 HYDROPHOBIC COATING COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-12-07 EP disclosed
CN-115335464-A Hydrophobic coating composition 迈图高新材料公司 2022-11-11 CN disclosed
US-20220056270-A1 CURABLE SILICONE-BASED COMPOSITIONS AND APPLICATIONS THEREOF MOMENTIVE PERFORMANCE MATERIALS INC. 2022-02-24 US disclosed
US-20210363290-A1 POLYOL COMPOSITIONS PRESIDIUM USA INC (US) 2021-11-25 US disclosed
US-20060135731-A1 Method for the preparation of bis(haloimides) GENERAL ELECTRIC COMPANY (US) 2006-06-22 US disclosed
EP-1672720-A2 Surface modified electrodes and devices using reduced organic materials The General Electric Company (US) 2006-06-21 EP disclosed
US-20060128853-A1 Compositions for articles comprising replicated microstructures GENERAL ELECTRIC COMPANY (US) 2006-06-15 US disclosed
WO-2006057810-A1 CARBOXY-TERMINATED OLIGOMERIC POLYESTER COMPOSITIONS AND METHOD FOR MAKING GENERAL ELECTRIC COMPANY (US) 2006-06-01 WO disclosed
US-20060116487-A1 Carboxy-terminated oligomeric polyester compositions and method for making GENERAL ELECTRIC COMPANY 2006-06-01 US disclosed
US-20060093826-A1 Compositions useful as coatings, their preparation, and articles made therefrom GENERAL ELECTRIC COMPANY (US) 2006-05-04 US disclosed
US-20060030683-A1 Polyethersulfone compositions GENERAL ELECTRIC COMPANY 2006-02-09 US disclosed
US-20050256290-A1 Monomers and polymers comprising conjugated groups and methods for making thereof GENERAL ELECTRIC COMPANY 2005-11-17 US disclosed
WO-2005073271-A1 COMPOSITIONS USEFUL AS COATINGS, THEIR PREPARATION, AND ARTICLES MADE THEREFROM GENERAL ELECTRIC COMPANY (US) 2005-08-11 WO disclosed
US-20050159542-A1 Compositions useful as coatings, their preparation, and articles made therefrom GENERAL ELECTRIC COMPANY 2005-07-21 US disclosed