SCHEMBL26124667

SCHEMBL26124667

CCCCOC(=S)SCCCC.[Cu]

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 3/20 0.42
CA1 P00915 3/20 0.42
CA2 P00918 3/20 0.42
CA9 Q16790 3/20 0.42
ALDH1A1 P00352 2/20 0.40
NOS3 P29474 1/20 0.39
NOS1 P29475 1/20 0.39
NOS2 P35228 1/20 0.39
ATM Q13315 1/20 0.38
TSHR P16473 3/20 0.35
HPGD P15428 1/20 0.35
ACHE P22303 3/20 0.35
CYP2D6 P10635 1/20 0.34
LMNA P02545 2/20 0.34
HTT P42858 1/20 0.34
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33
PDE4D Q08499 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6053634 0.98 CA12 (0.43) CA12CA1CA2CA9ALDH1A1
SCHEMBL31257889 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
Ammonia Solution, Strong SCHEMBL27696161 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
SCHEMBL148184 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
SCHEMBL28638220 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
SCHEMBL79082 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
SCHEMBL1618010 0.96 CA12 (0.42) CA12CA1CA2CA9ALDH1A1
SCHEMBL28440088 0.94 CA12 (0.41) CA12CA1CA2CA9ALDH1A1
SCHEMBL27516618 0.94 CA12 (0.41) CA12CA1CA2CA9ALDH1A1
SCHEMBL29196535 0.94 CA12 (0.43) CA12CA1CA2CA9ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023190063-A1 PRODUCTION METHOD FOR CURED PRODUCT, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, PROCESSING LIQUID, AND RESIN COMPOSITION 富士フイルム株式会社 2023-10-05 WO disclosed
CN-115867866-A Method for producing cured product, resin composition, developer, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-03-28 CN disclosed
CN-115768832-A Resin composition, method for producing same, and method for producing composition for pattern formation 富士胶片株式会社 2023-03-07 CN disclosed
CN-115729037-A Cured product, laminate, semiconductor device, method for producing same, resin composition, and compound 富士胶片株式会社 2023-03-03 CN disclosed
CN-114761466-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-15 CN disclosed