SCHEMBL2618628

SCHEMBL2618628

CCC(C)(C)C(=O)OC12CC3CC(C(=O)OC(C)(C)C)(CC(C1)C(=O)O3)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12430068 0.91
SCHEMBL13884086 0.90
SCHEMBL13817679 0.89
SCHEMBL2618629 0.88
SCHEMBL13865524 0.86
SCHEMBL2618627 0.82
SCHEMBL2618626 0.82
SCHEMBL111524 0.81
SCHEMBL107052 0.81
SCHEMBL13402443 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 221 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9551928-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2017-01-24 US disclosed
US-9051403-B2 Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition FUJIFILM CORPORATION (JP) 2015-06-09 US disclosed
US-9046773-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method using the same, polymerizable compound and polymer compound obtained by polymerizing the polymerizable compound FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
US-9046766-B2 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
US-9046782-B2 Resist composition for negative tone development and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
US-9017917-B2 Resist composition and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2015-04-28 US disclosed
US-9012123-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-04-21 US disclosed
US-8877969-B2 Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2014-11-04 US disclosed
US-8871421-B2 Positive resist composition and method of pattern formation with the same FUJIFILM CORPORATION (JP) 2014-10-28 US disclosed
US-8808975-B2 Positive resist composition for immersion exposure and pattern-forming method using the same FUJIFILM CORPORATION (JP) 2014-08-19 US disclosed
US-7192681-B2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-03-20 US disclosed
US-7192681-B2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-03-20 US disclosed
US-20070059639-A1 Positive resist composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2007-03-15 US disclosed
US-7189492-B2 Photosensitive composition and pattern forming method using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-03-13 US disclosed
US-20070054217-A1 Positive photosensitive composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2007-03-08 US disclosed
US-20070042290-A1 resin containing acrylic ester monomers capable of increasing solubility in alkali developer by action of acid, acid generator, aryldicycloalkylsulfonium compounds, and nonionic surfactant; semiconductors, integrated circuits FUJI PHOTO FILM CO., LTD. 2007-02-22 US disclosed
US-7179578-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7179578-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-20070031757-A1 Positive photosensitive composition and method of pattern formation with the same FUJI PHOTO FILM CO., LTD. 2007-02-08 US disclosed
US-20070026343-A1 Chemical amplification-type resist composition and production process thereof FUJI PHOTO FILM CO., LTD. 2007-02-01 US disclosed