⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12193709 | 0.84 | — | — | |
| SCHEMBL14086280 | 0.83 | — | — | |
| SCHEMBL14085984 | 0.81 | — | — | |
| SCHEMBL2618644 | 0.81 | — | — | |
| SCHEMBL12836391 | 0.80 | — | — | |
| SCHEMBL18177009 | 0.80 | — | — | |
| SCHEMBL13642076 | 0.79 | — | — | |
| SCHEMBL12295180 | 0.79 | — | — | |
| SCHEMBL13305425 | 0.78 | — | — | |
| SCHEMBL12308230 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12517429-B2 | Radiation-sensitive resin composition and method for forming pattern | JSR CORPORATION (JP) | 2026-01-06 | — | — | US | disclosed |
| US-20250377590-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | JSR CORPORATION (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250321484-A1 | METHOD FOR FORMING RESIST PATTERN AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2025-10-16 | — | — | US | disclosed |
| US-12422748-B2 | Radiation-sensitive resin composition and method for forming resist pattern | JSR CORPORATION (JP) | 2025-09-23 | — | — | US | disclosed |
| US-12265331-B2 | Radiation-sensitive resin composition and method for forming resist pattern | JSR CORPORATION (JP) | 2025-04-01 | — | — | US | disclosed |
| US-12092957-B2 | Radiation-sensitive resin composition, method for forming resist pattern and compound | JSR CORPORATION (JP) | 2024-09-17 | — | — | US | disclosed |
| US-11966160-B2 | Radiation-sensitive resin composition and method for forming pattern | JSR CORPORATION (JP) | 2024-04-23 | — | — | US | disclosed |
| US-20230393469-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER, AND COMPOUND | JSR CORPORATION (JP) | 2023-12-07 | — | — | US | disclosed |
| US-20230341772-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | JSR CORPORATION (JP) | 2023-10-26 | — | — | US | disclosed |
| US-11747725-B2 | Radiation-sensitive resin composition and method for forming resist pattern | JSR CORPORATION (JP) | 2023-09-05 | — | — | US | disclosed |
| US-7195856-B2 | Positive resist composition and pattern formation method using the same | FUJIFILM CORPORATION (JP) | 2007-03-27 | — | — | US | disclosed |
| US-7195856-B2 | Positive resist composition and pattern formation method using the same | FUJIFILM CORPORATION (JP) | 2007-03-27 | — | — | US | disclosed |
| US-7192685-B2 | Positive resist composition and method of forming resist pattern using the same. | FUJI PHOTO FILM CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| US-7192685-B2 | Positive resist composition and method of forming resist pattern using the same. | FUJI PHOTO FILM CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| US-7189492-B2 | Photosensitive composition and pattern forming method using the same | FUJI PHOTO FILM CO., LTD. (JP) | 2007-03-13 | — | — | US | disclosed |
| US-20070054214-A1 | Acid generators, sulfonic acids, sulfonyl halides, and radiation sensitive resin compositions | JSR CORPORATION (JP) | 2007-03-08 | — | — | US | disclosed |
| US-20070026343-A1 | Chemical amplification-type resist composition and production process thereof | FUJI PHOTO FILM CO., LTD. | 2007-02-01 | — | — | US | disclosed |
| US-20070026343-A1 | Chemical amplification-type resist composition and production process thereof | FUJI PHOTO FILM CO., LTD. | 2007-02-01 | — | — | US | disclosed |
| EP-1748318-A2 | Chemical amplification-type resist composition and production process thereof | Fuji Photo Film Co., Ltd. (JP) | 2007-01-31 | — | — | EP | disclosed |
| US-7157206-B2 | Resin containing an acid-decomposable group such as bis(trifluoromethyl)methanol group, to generate alkali-soluble group, and acid generators selected from fluorine-substituted or non-fluorine substituted aromatic or aliphatic carboxylic acid generators or sulfonic acid generators; microlithography | FUJI PHOTO FILM CO., LTD. (JP) | 2007-01-02 | — | — | US | disclosed |