SCHEMBL2620552

SCHEMBL2620552

CNCCC[Si](C)(C)O[Si](C)(C)CCCNC

nearest known ligand 0.36

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.36
HTR1B P28222 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14408045 0.91 EPHX1 (0.46) EPHX1
SCHEMBL26770215 0.90 EPHX1 (0.33) EPHX1
SCHEMBL9797843 0.90 EPHX1 (0.33) EPHX1
SCHEMBL19186053 0.89 EPHX1 (0.30) EPHX1
SCHEMBL14848714 0.88 EPHX1 (0.32) EPHX1
SCHEMBL29169937 0.84 EPHX1 (0.30) EPHX1
SCHEMBL14125305 0.84 KDM4E (0.48)
SCHEMBL200047 0.82 EPHX1 (0.35) EPHX1HTR1B
SCHEMBL19075846 0.81 HTR1B (0.32) HTR1B
SCHEMBL4394391 0.80 EPHX1 (0.33) EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3585845-B1 SILOXANE-BASED COATINGS CONTAINING POLYMERS WITH UREA LINKAGES AND TERMINAL ALKOXYSILANES US GOV SEC NAVY (US) 2024-11-20 EP disclosed
US-10190020-B2 Siloxane-based coatings containing polymers with urea linkages and terminal alkoxysilanes THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2019-01-29 US disclosed
US-10190020-B2 Siloxane-based coatings containing polymers with urea linkages and terminal alkoxysilanes THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2019-01-29 US disclosed
US-9944730-B2 Polymers derived from norbornadiene and maleic anhydride and use thereof PROMERUS, LLC (US) 2018-04-17 US disclosed
US-9932432-B2 Polymers of maleimide and cycloolefinic monomers as permanent dielectric materials PROMERUS, LLC (US) 2018-04-03 US disclosed
US-20180044449-A1 POLYMERS DERIVED FROM NORBORNADIENE AND MALEIC ANHYDRIDE AND USE THEREOF PROMERUS, LLC (US) 2018-02-15 US disclosed
US-20180030189-A1 NADIC ANHYDRIDE POLYMERS AND PHOTOSENSITIVE COMPOSITIONS DERIVED THEREFROM PROMERUS, LLC (US) 2018-02-01 US disclosed
EP-2970709-B1 SINGLE-COMPONENT MOISTURE-CURABLE COATINGS BASED ON N-SUBSTITUTED UREA POLYMERS WITH EXTENDED CHAINS AND TERMINAL ALKOXYSILANES US GOV SEC NAVY (US) 2017-10-18 EP disclosed
US-9701868-B2 Single-component moisture-curable coatings based on N-substituted urea polymers with extended chains and terminal alkoxysilanes THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2017-07-11 US disclosed
US-20170183534-A1 SILOXANE-BASED COATINGS CONTAINING POLYMERS WITH UREA LINKAGES AND TERMINAL ALKOXYSILANES THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2017-06-29 US disclosed
US-20110200937-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2011-08-18 US disclosed
US-20110136952-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO., LTD. (JP) 2011-06-09 US disclosed
US-7781131-B2 Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith SUMITOMO BAKELITE CO., LTD. (JP) 2010-08-24 US disclosed
US-20090166818-A1 Positive Photosensitive Resin Composition, and Semiconductor Device and Display Therewith SUMITOMO BAKELITE COMPANY LIMITED (JP) 2009-07-02 US disclosed
US-20090068584-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH SUMITOMO BAKELITE CO., LTD. (JP) 2009-03-12 US disclosed
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 US disclosed