SCHEMBL262215

SCHEMBL262215

O=C(O)c1ccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4ccc(C(=O)O)c(C(=O)O)c4)cc3)cc2)cc1C(=O)O

nearest known ligand 0.77

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.77
APEX1 P27695 2/20 0.77
L3MBTL1 Q9Y468 2/20 0.77
CTDSP1 Q9GZU7 1/20 0.77
KDM4E B2RXH2 1/20 0.51
ALDH1A1 P00352 2/20 0.50
CYP2C9 P11712 2/20 0.49
CYP1A2 P05177 1/20 0.49
CYP2C19 P33261 1/20 0.49
HTT P42858 2/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
MCL1 Q07820 2/20 0.48
HPSE Q9Y251 1/20 0.48
TDP1 Q9NUW8 4/20 0.47
LMNA P02545 1/20 0.47
MMP2 P08253 1/20 0.46
MMP3 P08254 1/20 0.46
MMP9 P14780 1/20 0.46
MMP8 P22894 1/20 0.46
MMP12 P39900 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30901879 1.00 POLB (0.77) POLBAPEX1L3MBTL1CTDSP1KDM4E
Water SCHEMBL6408071 0.98 POLB (0.75) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL11008742 0.95 POLB (0.71) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL10450773 0.93 POLB (0.88) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL32680447 0.88 POLB (0.61) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL15708520 0.87 APEX1 (1.00) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL29406842 0.87 POLB (0.73) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL145176 0.87 POLB (0.73) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL30553345 0.87 POLB (0.73) POLBAPEX1L3MBTL1CTDSP1KDM4E
SCHEMBL30901880 0.87 POLB (0.73) POLBAPEX1L3MBTL1CTDSP1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1903 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024067649-A1 DIAMINE COMPOUND, POLYIMIDE ACID, POLYIMIDE, AND PREPARATION METHOD THEREFOR AND USE THEREOF 比亚迪股份有限公司 2024-04-04 WO claimed
US-11905381-B2 Polyimide microparticles XEROX CORPORATION (US) 2024-02-20 US claimed
WO-2023029341-A1 COLORLESS TRANSPARENT POLYIMIDE RESIN FILM AND PREPARATION METHOD THEREFOR 山东中柔新材料有限公司 2023-03-09 WO claimed
EP-4089136-A1 POLYIMIDE MICROPARTICLES Xerox Corporation (US) 2022-11-16 EP claimed
EP-3640275-B1 CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF SHPP GLOBAL TECH BV (NL) 2022-06-29 EP claimed
EP-3640275-A1 CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF SABIC Global Technologies B.V. (NL) 2020-04-22 EP claimed
US-20200115544-A1 CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2020-04-16 US claimed
US-9975997-B2 Compositions, composites prepared therefrom, and films and electronic devices including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-05-22 US claimed
US-20160280857-A1 COMPOSITIONS, COMPOSITES PREPARED THEREFROM, AND FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-09-29 US claimed
US-20160009862-A1 TRANSPARENT POLYMER FILM AND ELECTRONIC DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-01-14 US claimed
EP-1287076-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2003-03-05 EP claimed
US-6500904-B1 FROM THE COUPLING OF LOWER MOLECULAR WEIGHT FUNCTIONALIZED PRECURSOR POLYIMIDES GENERAL ELECTRIC COMPANY 2002-12-31 US claimed
US-6436593-B1 A POLYIMIDE PRECURSOR OR A POLYOXAZOLE PRECURSOR HAVING A GROUP REPRESENTED BY--OR, ACID GENERATION WITH RADIATION HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2002-08-20 US claimed
EP-1229066-A1 Photoactive polymer Rolic AG (CH) 2002-08-07 EP claimed
WO-2001096477-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2001-12-20 WO claimed
EP-1089129-A1 Positive type photosensitive resin composition, process for producing pattern and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2001-04-04 EP claimed
US-4925915-A FLUORINE CONTAINING POLYIMIDES HOECHST CELANESE CORP. (US) 1990-05-15 US claimed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
US-4045409-A Thermally stable, highly fused imide compositions THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 1977-08-30 US claimed
US-3965125-A Synthesis of certain bis(phthalic anhydrides) TRW INC. (US) 1976-06-22 US claimed