SCHEMBL2632819

SCHEMBL2632819

CC1=NCC(C)N1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21888973 1.00
SCHEMBL21400630 0.74
SCHEMBL13537576 0.70
SCHEMBL13049139 0.70
SCHEMBL13770769 0.69
SCHEMBL20026331 0.67
SCHEMBL21135541 0.67
SCHEMBL21322312 0.67
SCHEMBL3847450 0.67
SCHEMBL7758130 0.67 NISCH (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111511809-B Curing agent composition and resin composition containing the same 赫克塞尔合成有限公司 2024-08-16 CN claimed
US-20210102027-A1 Potting Compound and Insulating Material SIEMENS AKTIENGESELLSCHAFT (DE) 2021-04-08 US claimed
EP-3523348-A1 POTTING COMPOUND, INSULATING MATERIAL, AND USE THEREOF Siemens Aktiengesellschaft (DE) 2019-08-14 EP claimed
CN-110023371-A Perfusion materia, insulating materials and application thereof 西门子股份公司 2019-07-16 CN claimed
WO-2018099891-A1 POTTING COMPOUND, INSULATING MATERIAL, AND USE THEREOF SIEMENS AKTIENGESELLSCHAFT (DE) 2018-06-07 WO claimed
CN-113444340-B Resin composition 味之素株式会社 2025-06-10 CN disclosed
CN-119998945-A Resin composition, adhesive, sealant, cured product, and semiconductor device 纳美仕有限公司 2025-05-13 CN disclosed
CN-119998352-A Epoxy resin curing agent, epoxy resin composition, sealing material, electrically conductive material, thermally conductive material, adhesive for camera module, adhesive for structure, matrix resin for fiber-reinforced plastic, impregnating and fixing material, interlayer insulating film, film-type solder resist, sealing sheet, electrically conductive film, anisotropic electrically conductive film, thermally conductive film, and method for producing dyed cured product 旭化成株式会社 2025-05-13 CN disclosed
CN-112724596-B Curable composition and cured product 盛势达技研株式会社 2025-04-18 CN disclosed
CN-112745793-B Curable composition 味之素株式会社 2025-03-14 CN disclosed
CN-119365518-A Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayer body, and fiber-reinforced composite material 三菱瓦斯化学株式会社 2025-01-24 CN disclosed
CN-119183463-A Curing agent and use thereof 四国化成工业株式会社 2024-12-24 CN disclosed
US-20110086840-A1 N-7 SUBSTITUTED PURINE AND PYRAZOLOPYRIMINE COMPOUNDS, COMPOSITIONS AND METHODS OF USE GENENTECH, INC. (US) 2011-04-14 US disclosed
US-20110086840-A1 N-7 SUBSTITUTED PURINE AND PYRAZOLOPYRIMINE COMPOUNDS, COMPOSITIONS AND METHODS OF USE GENENTECH, INC. (US) 2011-04-14 US disclosed
US-20110086841-A1 N-9 SUBSTITUTED PURINE COMPOUNDS, COMPOSITIONS AND METHODS OF USE GENENTECH, INC. (US) 2011-04-14 US disclosed
US-20100069357-A1 PYRIMIDINE COMPOUNDS, COMPOSITIONS AND METHODS OF USE GENENTECH, INC. (US) 2010-03-18 US disclosed
EP-1386908-B1 AMINE DERIVATIVE WITH POTASSIUM CHANNEL REGULATORY FUNCTION, ITS PREPARATION AND USE INST PHARM & TOXICOLOGY AMMS (CN) 2010-03-03 EP disclosed
WO-2010014939-A1 PYRIMIDINE COMPOUNDS, COMPOSITIONS AND METHODS OF USE GENENTECH, INC. (US) 2010-02-04 WO disclosed
US-7560473-B2 Amine derivative with potassium channel regulatory function, its preparation and use INSTITUTE OF PHARMACOLOGY AND TOXICOLOGY ACADEMY OF MILITARY MEDICAL SCIENCES, P.L.A. (CN) 2009-07-14 US disclosed
US-7560473-B2 Amine derivative with potassium channel regulatory function, its preparation and use INSTITUTE OF PHARMACOLOGY AND TOXICOLOGY ACADEMY OF MILITARY MEDICAL SCIENCES, P.L.A. (CN) 2009-07-14 US disclosed