SCHEMBL263825

SCHEMBL263825

C=CCO[SiH2]C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14902824 0.76
SCHEMBL1482684 0.73
SCHEMBL29277813 0.71
SCHEMBL15130316 0.69
SCHEMBL28008368 0.69
SCHEMBL298610 0.69
SCHEMBL5694333 0.69
SCHEMBL1362541 0.69
SCHEMBL7521611 0.69
SCHEMBL30974642 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1141443-B1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED NKT RES & INNOVATION AS (DK) 2004-01-14 EP claimed
EP-1141443-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED NKT RESEARCH CENTER A/S (DK) 2001-10-10 EP claimed
WO-2000020656-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED N.K.T. RESEARCH CENTER A/S (DK) 2000-04-13 WO claimed
US-20260015443-A1 POLYPROPLYENE COMPOSITIONS WITH ENHANCED STRAIN HARDENING AND METHODS OF PRODUCING THE SAME EXXONMOBIL CHEMICAL PATENTS INC. (US) 2026-01-15 US disclosed
US-12435167-B2 Processes for producing polyolefins and impact copolymers with broad molecular weight distribution and high stiffness EXXONMOBIL CHEMICAL PATENTS INC. (US) 2025-10-07 US disclosed
CN-119630709-A Strain hardening reinforced polypropylene composition and method for producing the same 埃克森美孚化学专利公司 2025-03-14 CN disclosed
CN-117716295-A Composition for forming silicon-containing resist underlayer film and silicon-containing resist underlayer film 日产化学株式会社 2024-03-15 CN disclosed
CN-114555656-B Process for preparing polyolefin and impact copolymers having broad molecular weight distribution and high stiffness 埃克森美孚化学专利公司 2024-02-20 CN disclosed
WO-2024025741-A1 POLYPROPYLENE COMPOSITIONS WITH ENHANCED STRAIN HARDENING AND METHODS OF PRODUCING SAME EXXONMOBIL CHEMICAL PATENTS INC. (US) 2024-02-01 WO disclosed
CN-117255971-A Composition for forming silicon-containing resist underlayer film 日产化学株式会社 2023-12-19 CN disclosed
EP-3635019-B1 BROAD MOLECULAR WEIGHT DISTRIBUTION POLYPROPYLENES WITH HIGH MELT FLOW RATES AND HIGH FLEXURAL MODULUS EXXONMOBIL CHEMICAL PATENTS INC (US) 2023-10-25 EP disclosed
CN-1324412-A Method for metallizing surface of a solid polymer substrate and the product obtd. N K T RES CT AS (DK) 2001-11-28 CN disclosed
EP-1141443-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED NKT RESEARCH CENTER A/S (DK) 2001-10-10 EP disclosed
EP-1141443-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED NKT RESEARCH CENTER A/S (DK) 2001-10-10 EP disclosed
WO-2000020656-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED N.K.T. RESEARCH CENTER A/S (DK) 2000-04-13 WO disclosed
WO-2000020656-A1 A METHOD OF METALLIZING THE SURFACE OF A SOLID POLYMER SUBSTRATE AND THE PRODUCT OBTAINED N.K.T. RESEARCH CENTER A/S (DK) 2000-04-13 WO disclosed
CN-1029233-C Process for polymerizing olefins and catalyst for polymerizing olefins MITSUI PETROCHEMICAL IND (JP) 1995-07-05 CN disclosed
CN-1045400-A The catalyzer that the polymerization process of alkene and polymerizing olefins are used MITSUI PETROCHEMICAL IND (JP) 1990-09-19 CN disclosed
EP-0385765-A2 Process for polymerizing olefins and catalyst for polymerizing olefins MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-09-05 EP disclosed
EP-0317262-A2 Transparent resin material JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-05-24 EP disclosed