⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Charcoal, Activated SCHEMBL2787423 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL5573687 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL29389177 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL31277091 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL29788973 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL716926 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL11150029 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL30285545 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL3473086 | 0.82 | — | — | |
| SCHEMBL2422998 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 276 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118664923-A | Carbon fiber composite material chest rib integrated artificial bone and preparation method thereof | 湖南碳康生物科技有限公司 | 2024-09-20 | — | — | CN | claimed |
| CN-117964403-A | Preparation method of double-layer tantalum carbide coating and graphite component | 杭州乾晶半导体有限公司 | 2024-05-03 | — | — | CN | claimed |
| CN-115003016-B | Extra thin copper foil with carrier for electronic circuit | 九江德福科技股份有限公司 | 2024-01-26 | — | — | CN | claimed |
| CN-111647505-B | DNA acquisition swab and preparation method and application thereof | 上海市刑事科学技术研究院 | 2023-12-19 | — | — | CN | claimed |
| CN-115003016-A | Carrier-attached ultrathin copper foil for electronic circuit | 九江德福科技股份有限公司 | 2022-09-02 | — | — | CN | claimed |
| CN-110556334-B | Method for semiconductor processing and semiconductor structure | 台湾积体电路制造股份有限公司 | 2022-08-23 | — | — | CN | claimed |
| EP-2520691-B1 | TANTALUM CARBIDE-COATED CARBON MATERIAL AND MANUFACTURING METHOD FOR SAME | TOYO TANSO CO (JP) | 2022-08-10 | — | — | EP | claimed |
| US-11004950-B2 | Integrated circuit metal gate structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2021-05-11 | — | — | US | claimed |
| WO-2019178938-A1 | ALL-WEATHER SELF-HEALING STRETCHABLE CONDUCTIVE MATERIAL AND PREPARATION METHOD THEREFOR | 常州大学 | 2019-09-26 | — | — | WO | claimed |
| CN-110002892-A | A kind of hafnium tantalum silicon ternary complex phase ceramic presoma, carbon/hafnium tantalum carbon solid solution-carbon/silicon carbide ceramic matrix composite and preparation method thereof | 航天特种材料及工艺技术研究所 | 2019-07-12 | — | — | CN | claimed |
| US-20160104840-A1 | RESISTIVE MEMORY WITH A THERMALLY INSULATING REGION | SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) | 2016-04-14 | — | — | US | claimed |
| US-20120301723-A1 | TANTALUM CARBIDE-COATED CARBON MATERIAL AND MANUFACTURING METHOD FOR SAME | TOYO TANSO CO., LTD. (JP) | 2012-11-29 | — | — | US | claimed |
| EP-2520691-A1 | TANTALUM CARBIDE-COATED CARBON MATERIAL AND MANUFACTURING METHOD FOR SAME | Toyo Tanso Co., Ltd. (JP) | 2012-11-07 | — | — | EP | claimed |
| US-8236686-B2 | Dual metal gates using one metal to alter work function of another metal | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-08-07 | — | — | US | claimed |
| US-20100061847-A1 | STEAM TURBINE PART INCLUDING CERAMIC MATRIX COMPOSITE (CMC) | GENERAL ELECTRIC COMPANY (US) | 2010-03-11 | — | — | US | claimed |
| EP-2161414-A1 | Steam turbine part including ceramic matrix composite (CMC) | General Electric Company (US) | 2010-03-10 | — | — | EP | claimed |
| US-20090294867-A1 | DUAL METAL GATES USING ONE METAL TO ALTER WORK FUNCTION OF ANOTHER METAL | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2009-12-03 | — | — | US | claimed |
| US-7459392-B2 | Noble metal barrier and seed layer for semiconductors | INTEL CORPORATION (US) | 2008-12-02 | — | — | US | claimed |
| US-20060220249-A1 | Nobel metal barrier and seed layer for semiconductors | INTEL CORPORATION | 2006-10-05 | — | — | US | claimed |
| WO-2004114386-A2 | METHODS AND SYSTEM FOR PROCESSING A MICROELECTRONIC TOPOGRAPHY | BLUE29 CORPORATION (US) | 2004-12-29 | — | — | WO | claimed |