SCHEMBL26528510

SCHEMBL26528510

CC(NC(C)C1CCCC(CN)C1)C1CCCC(CN)C1

nearest known ligand 0.38

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.30
CYP2D6 P10635 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25895606 0.87
SCHEMBL19300342 0.82 EPHX1 (0.33) EPHX1
SCHEMBL19728160 0.82 EPHX1 (0.33) EPHX1
SCHEMBL10177714 0.82 EPHX1 (0.33) EPHX1
SCHEMBL19728161 0.82 EPHX1 (0.33) EPHX1
SCHEMBL19300340 0.82 EPHX1 (0.33) EPHX1
SCHEMBL7492568 0.80 EPHX1 (0.32) EPHX1
SCHEMBL21510159 0.80
SCHEMBL25868561 0.79 MEN1 (0.32)
SCHEMBL25868537 0.78 TP53 (0.38) EPHX1CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230323018-A1 EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, AND USE OF AMINE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-12 US disclosed