Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.68 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.68 |
| ▸ | THRB | P10828 | 1/20 | 0.68 |
| ▸ | HTT | P42858 | 1/20 | 0.68 |
| ▸ | MAPT | P10636 | 1/20 | 0.68 |
| ▸ | TSHR | P16473 | 1/20 | 0.52 |
| ▸ | USP2 | O75604 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | LMNA | P02545 | 2/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | CASP1 | P29466 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | SLCO1B3 | Q9NPD5 | 1/20 | 0.43 |
| ▸ | SLCO1B1 | Q9Y6L6 | 1/20 | 0.43 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.40 |
| ▸ | LPAR1 | Q92633 | 4/20 | 0.38 |
| ▸ | LPAR3 | Q9UBY5 | 4/20 | 0.38 |
| ▸ | LPAR2 | Q9HBW0 | 1/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20496746 | 1.00 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL7181440 | 0.93 | HTT (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL2721221 | 0.92 | TSHR (0.61) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL30965414 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL31719675 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL29656642 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL30965423 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL29656974 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL30965426 | 0.89 | MEN1 (0.68) | MEN1KMT2ATHRBHTTMAPT | |
| SCHEMBL4377551 | 0.88 | MEN1 (0.54) | MEN1KMT2ATHRBHTTMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117020592-B | Self-soldering composite soldering tin ball, preparation method and electronic device | 中国机械总院集团宁波智能机床研究院有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-117020592-A | Self-soldering composite soldering tin ball, preparation method and electronic device | 中国机械总院集团宁波智能机床研究院有限公司 | 2023-11-10 | — | — | CN | claimed |
| US-20230227718-A1 | METAL OXIDE COMPOSITION, LIGHT-EMITTING DEVICE USING THE METAL OXIDE COMPOSITION, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-07-20 | — | — | US | claimed |
| CN-108587324-A | Printing ink composition | 精工爱普生株式会社 | 2018-09-28 | — | — | CN | claimed |
| CN-104293009-B | Manufacturing method of conductive coating solution composition capable of shielding electromagnetic interference | 株式会社大河曼泰克 | 2017-04-12 | — | — | CN | claimed |
| CN-117020592-B | Self-soldering composite soldering tin ball, preparation method and electronic device | 中国机械总院集团宁波智能机床研究院有限公司 | 2024-02-02 | — | — | CN | disclosed |
| CN-117020592-A | Self-soldering composite soldering tin ball, preparation method and electronic device | 中国机械总院集团宁波智能机床研究院有限公司 | 2023-11-10 | — | — | CN | disclosed |
| US-20230227718-A1 | METAL OXIDE COMPOSITION, LIGHT-EMITTING DEVICE USING THE METAL OXIDE COMPOSITION, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-07-20 | — | — | US | disclosed |
| CN-116456740-A | Metal oxide composition, light-emitting element, and electronic device | 三星显示有限公司 | 2023-07-18 | — | — | CN | disclosed |
| CN-112719694-B | Soldering flux composition, preparation method of soldering flux composition, gold-tin soldering paste for spray printing and preparation method of gold-tin soldering paste | 广州先艺电子科技有限公司 | 2021-11-19 | — | — | CN | disclosed |
| CN-112719694-A | Soldering flux composition, preparation method of soldering flux composition, gold-tin soldering paste for spray printing and preparation method of gold-tin soldering paste | 广州先艺电子科技有限公司 | 2021-04-30 | — | — | CN | disclosed |
| CN-110496767-A | It shows the manufacturing method of the printed article in the photosensitive pool of metal, show the printed article and ink-jet printer in the photosensitive pool of metal | MIMAKI ENG CO LTD | 2019-11-26 | — | — | CN | disclosed |
| US-20090029049-A1 | ANTIPENETRATING AGENT, SOLVENT INK FOR INKJET PRINTING AND PRINTING METHOD | MIMAKI ENGINEERING CO., LTD. (JP) | 2009-01-29 | — | — | US | disclosed |
| US-20080281043-A1 | PENETRATION INHIBITOR, METHOD FOR PREVENTING PENETRATION OF SOLVENT INK, SOLVENT INK FOR INJKET PRINTER AND METHOD FOR PRODUCING THE SOLVENT INK | MIMAKI ENGINEERING CO., LTD. (JP) | 2008-11-13 | — | — | US | disclosed |
| EP-1975209-A1 | Solvent inkjet ink. | Mimaki Engineering Co., Ltd. (JP) | 2008-10-01 | — | — | EP | disclosed |
| CN-101275041-A | Penetration inhibitor, solvent inkjet ink, and penetration inhibiting method | MIMAKI ENG KK (JP) | 2008-10-01 | — | — | CN | disclosed |
| JP-2008106128-A | LIQUID CLEANSER COMPOSITION | KAO CORP | 2008-05-08 | — | — | JP | disclosed |
| EP-1911818-A1 | Solvent inkjet ink. | Mimaki Engineering Co., Ltd. (JP) | 2008-04-16 | — | — | EP | disclosed |
| CN-101161735-A | Penetration inhibitor, penetration inhibiting method, and solvent inkjet ink | MIMAKI ENG KK (JP) | 2008-04-16 | — | — | CN | disclosed |
| CN-1074647-C | Emulsifiable composition for control of insects | RHONE POULENC AGROCHIMIE (FR) | 2001-11-14 | — | — | CN | disclosed |