Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HRH1 | P35367 | 5/20 | 0.78 |
| ▸ | HTR2A | P28223 | 5/20 | 0.59 |
| ▸ | CNR1 | P21554 | 1/20 | 0.51 |
| ▸ | CNR2 | P34972 | 1/20 | 0.51 |
| ▸ | TAAR1 | Q96RJ0 | 2/20 | 0.50 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.47 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.47 |
| ▸ | HTR1B | P28222 | 1/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.42 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.42 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.42 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.42 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.42 |
| ▸ | HTR1A | P08908 | 1/20 | 0.42 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.42 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.42 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.42 |
| ▸ | SMPD1 | P17405 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29816253 | 0.93 | HRH1 (0.65) | HRH1HTR2ACNR1CNR2TAAR1 | |
| SCHEMBL158098 | 0.89 | HRH1 (1.00) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| SCHEMBL8140507 | 0.88 | HRH1 (0.80) | HRH1HTR2ACNR1CNR2TAAR1 | |
| Bromide SCHEMBL28357929 | 0.86 | HRH1 (0.95) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| Hydrochloric Acid SCHEMBL5011445 | 0.86 | HRH1 (0.95) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| Iodide SCHEMBL28361744 | 0.86 | HRH1 (0.95) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| Ammonia Solution, Strong SCHEMBL3795841 | 0.86 | HRH1 (0.95) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| SCHEMBL757855 | 0.82 | TAAR1 (0.76) | HRH1HTR2ACNR1CNR2TAAR1 | |
| SCHEMBL486888 | 0.82 | HRH1 (0.69) | HRH1HTR2ATAAR1CHRNB2CHRNA4 | |
| SCHEMBL3110178 | 0.81 | CNR2 (0.47) | HRH1HTR2ACNR1CNR2TAAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118240361-A | Resin composition | 南亚塑胶工业股份有限公司 | 2024-06-25 | — | — | CN | disclosed |
| US-20240166817-A1 | RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2024-05-23 | — | — | US | disclosed |
| CN-117986861-A | Resin composition and electronic component | 南亚塑胶工业股份有限公司 | 2024-05-07 | — | — | CN | disclosed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| CN-117794048-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-117279198-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-117067718-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-117048152-A | Method for manufacturing metal-clad laminate | 日铁化学材料株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-116731318-A | polyimide resin | 南亚塑胶工业股份有限公司 | 2023-09-12 | — | — | CN | disclosed |
| US-20230279226-A1 | POLYIMIDE RESIN | NAN YA PLASTICS CORPORATION (TW) | 2023-09-07 | — | — | US | disclosed |
| EP-1826230-A1 | UNSATURATED GROUP-CONTAINING POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME, AND CURED PRODUCT THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2007-08-29 | — | — | EP | disclosed |
| EP-0648796-B1 | Solutions of polyimide-forming substances and their use | SCHENECTADY INT INC (US) | 1998-08-26 | — | — | EP | disclosed |
| US-5645979-A | Heat-resistant photoresist composition and negative-type pattern formation method | NITTO DENKO CORPORATION (JP) | 1997-07-08 | — | — | US | disclosed |
| US-5595856-A | Heat-resistant photoresist composition and negative-type pattern formation method | NITTO DENKO CORPORATION (JP) | 1997-01-21 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |
| US-5578696-A | POLYISOIMIDE | NITTO DENKO CORPORATION (JP) | 1996-11-26 | — | — | US | disclosed |
| US-5493003-A | MIXTURES OF AMINES, AMIDES AND/OR ESTERS OF TETRACARBOXYLIC ACIDS HAVING AMIDO OR ESTER GROUPS SUBSTITUTED WITH CARBOXYL, SULFO, SILYL OR SILOXY GROUPS, ELECTRONICS | BASF LACKE + FARBEN AKTIENGESELLSCHAFT (DE) | 1996-02-20 | — | — | US | disclosed |
| US-5478917-A | Aromatic polyamines, tetracarboxylic acid amides and esters; smoothness, flexibility | BASF LACKE + FARBEN AKTIENGESELLSCHAFT (DE) | 1995-12-26 | — | — | US | disclosed |
| EP-0648796-A1 | Solutions of polyimide-forming substances and their use | BASF Lacke + Farben AG (DE) | 1995-04-19 | — | — | EP | disclosed |
| EP-0648795-A1 | Solutions of polyimide-forming substances and their use as coating material | BASF Lacke + Farben AG (DE) | 1995-04-19 | — | — | EP | disclosed |