SCHEMBL2688998

SCHEMBL2688998

CCC1=C(CC)C(CC)=C([Y])C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6285881 0.80
SCHEMBL2418897 0.80
SCHEMBL18428667 0.68
SCHEMBL22026612 0.68
SCHEMBL3909174 0.68
SCHEMBL6359958 0.68
Hydrochloric Acid SCHEMBL27437629 0.67
Hydrochloric Acid SCHEMBL3687074 0.67
Hydrochloric Acid SCHEMBL27437630 0.67
Hydrochloric Acid SCHEMBL3687072 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12509768-B2 Method of manufacturing semiconductor device, substrate processing apparatus and evaporation system Kokusai Electric Corporation (JP) 2025-12-30 US disclosed
US-20220042170-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND EVAPORATION SYSTEM Kokusai Electric Corporation (JP) 2022-02-10 US disclosed
US-10767260-B2 Substrate processing apparatus, vaporization system and mist filter Kokusai Electric Corporation (JP) 2020-09-08 US disclosed
US-10392700-B2 Solid vaporizer ENTEGRIS, INC. (US) 2019-08-27 US disclosed
US-20190032206-A1 Modular Tray Ampoule TRUIST BANK, AS NOTES COLLATERAL AGENT 2019-01-31 US disclosed
US-20180274093-A1 SUBSTRATE PROCESSING APPARATUS, VAPORIZATION SYSTEM AND MIST FILTER HITACHI KOKUSAI ELECTRIC INC. (JP) 2018-09-27 US disclosed
US-20170342557-A1 SOLID VAPORIZER TRUIST BANK, AS NOTES COLLATERAL AGENT 2017-11-30 US disclosed
WO-2015164029-A1 SOLID VAPORIZER ENTEGRIS, INC. (US) 2015-10-29 WO disclosed
US-20130267100-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND EVAPORATION SYSTEM HITACHI KOKUSAI ELECTRIC INC. (JP) 2013-10-10 US disclosed
US-8168547-B2 Manufacturing method of semiconductor device RENESAS ELECTRONICS CORPORATION (JP) 2012-05-01 US disclosed
US-20100187644-A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE RENESAS TECHNOLOGY CORP 2010-07-29 US disclosed
US-20090011608-A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE RENESAS TECHNOLOGY CORP. 2009-01-08 US disclosed
US-20080283929-A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME RENESAS TECHNOLOGY CORP. 2008-11-20 US disclosed