SCHEMBL269995

SCHEMBL269995

F[B-](F)(F)F.F[B-](F)(F)F.[Cu+2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6664029 1.00
SCHEMBL10821658 1.00
SCHEMBL1901658 1.00
SCHEMBL11143851 1.00
Water SCHEMBL1396983 0.91
Water SCHEMBL17199831 0.91
SCHEMBL1357777 0.91
SCHEMBL16047646 0.89
SCHEMBL63026 0.89
SCHEMBL5132904 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3902 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4747238-A1 PROCESS FOR PREPARING INTERMEDIATES OF SARTAN ACTIVE COMPOUNDS Sanofi (FR) 2026-05-27 EP claimed
CN-122057451-A CO (carbon monoxide)2Preparation method of graded porous MOF nanofiber aerogel for trapping 东华大学 2026-05-19 CN claimed
CN-119462342-B Method for effectively improving purity of linalool product 万华化学集团股份有限公司 2026-05-19 CN claimed
EP-4724540-A1 A METHOD OF BONDING SUBSTRATES Henkel AG & Co. KGaA (DE) 2026-04-15 EP claimed
US-12599138-B2 Cellulosic fibers comprising internally dispersed cuprous oxide nanoparticles THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF AGRICULTURE (US) 2026-04-14 US claimed
US-20260092199-A1 Method of Bonding Substrates HENKEL AG & CO KGAA (DE) 2026-04-02 US claimed
US-20260049173-A1 EPOXY-ALCOHOL-BASED MULTI-COMPONENT RESIN SYSTEM HILTI AKTIENGESELLSCHAFT (LI) 2026-02-19 US claimed
US-20260041714-A1 CROSS-LINKING AGENTS AND ASSOCIATED METHODS UNIV UTAH RES FOUND (US) 2026-02-12 US claimed
US-12439528-B2 Method of preparing a high density interconnect printed circuit board including microvias filled with copper Atotech Deutschland GmbH & Co. KG (DE) 2025-10-07 US claimed
EP-3601663-B1 ODOR CONTROL PULP COMPOSITION INT PAPER CO (US) 2025-07-30 EP claimed
EP-0096034-A1 ELECTROLESS COPPER DEPOSITION SOLUTIONS. MACDERMID INC (US) 1983-12-21 EP claimed
WO-1983002287-A1 ELECTROLESS COPPER DEPOSITION SOLUTIONS MACDERMID INC (US) 1983-07-07 WO claimed
US-4374709-A PRETREATMENT WITH CONDITIONING SOLUTION CONTAINING COPPER IONS, ACID, AND A POLYETHER OCCIDENTAL CHEMICAL CORPORATION (US) 1983-02-22 US claimed
US-4325990-A Electroless copper deposition solutions with hypophosphite reducing agent MACDERMID INCORPORATED (US) 1982-04-20 US claimed
US-4211828-A COPPER IONS, COMPLEXING AGENT, CONDUCTION ATLANTIC RICHFIELD COMPANY (US) 1980-07-08 US claimed
US-4156683-A CROWN COMPOUNDS USED AS CHELATING AGENTS SCHERING CORPORATION (US) 1979-05-29 US claimed
US-4103296-A COULOMETRIC ELECTROLYTIC TIMING DEVICE WITH COAXIALLY ALIGNED ELECTRODES AIR PRODUCTS & CHEMICALS, INC. (US) 1978-07-25 US claimed
US-4092296-A AUTOCATALYTIC CURING PROCESS, METALLIC FLUOROBORATE SALT SKIFF RUSSELL A 1978-05-30 US claimed
US-3957452-A ZINCATE ACTIVATION, BRASS, BRONZE GENERAL CABLE CORPORATION (US) 1976-05-18 US claimed
US-3930962-A PROCESS AND APPARATUS FOR PRODUCING THIN COPPER FOILS ON A MOLYBDENUM OR TZM ALLOY DRUM KENNECOTT COPPER CORPORATION (US) 1976-01-06 US claimed