SCHEMBL2705261

SCHEMBL2705261

CC(=O)CC(=O)OCC(C)COC(=O)CC(C)=O

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MGAM O43451 2/20 0.50
GAA P10253 2/20 0.50
SI P14410 2/20 0.50
MGAM2 Q2M2H8 2/20 0.50
TSHR P16473 3/20 0.35
TDP1 Q9NUW8 2/20 0.35
ALDH1A1 P00352 1/20 0.35
MAPT P10636 2/20 0.34
PRKCA P17252 2/20 0.32
HTT P42858 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.30
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28258087 0.88 MGAM (0.40) MGAMGAASIMGAM2
SCHEMBL28294012 0.87 MGAM (0.43) MGAMGAASIMGAM2TSHR
SCHEMBL27834437 0.87 MGAM (0.43) MGAMGAASIMGAM2TSHR
SCHEMBL472554 0.86 TSHR (0.50) MGAMGAASIMGAM2TSHR
SCHEMBL30059382 0.86 TSHR (0.50) MGAMGAASIMGAM2TSHR
SCHEMBL27524441 0.86 MGAM (0.41) MGAMGAASIMGAM2TSHR
SCHEMBL1081187 0.86 MGAM (0.41) MGAMGAASIMGAM2TSHR
SCHEMBL16411295 0.84 MAPT (0.50) MGAMGAASIMGAM2TSHR
SCHEMBL27551575 0.84 TSHR (0.48) MGAMGAASIMGAM2TSHR
SCHEMBL21955400 0.83 MGAM (0.52) MGAMGAASIMGAM2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12378434-B2 Curable coating compositions EASTMAN CHEMICAL COMPANY (US) 2025-08-05 US claimed
WO-2025149262-A1 CURABLE POLYMER COMPOSITION CONTAINING ALDEHYDES, COMPOUNDS WITH ACTIVATED METHYLENE GROUPS, AND AN ACCELERATOR COMPONENT SIKA TECHNOLOGY AG (CH) 2025-07-17 WO claimed
EP-4574871-A1 CURABLE POLYMER COMPOSITIONS COMPRISING ALDIMINES, POLYISOCYANATES AND COMPOUNDS WITH ACTIVATED METHYLENE GROUPS Sika Technology AG (CH) 2025-06-25 EP claimed
EP-4574867-A1 CURABLE POLYMER COMPOSITIONS CONTAINING ISOCYANATES, ALDIMINES AND COMPOUNDS HAVING ACTIVATED METHYLENE GROUPS Sika Technology AG (CH) 2025-06-25 EP claimed
CN-113166033-B Curable coating composition 伊士曼化工公司 2024-05-24 CN claimed
EP-3894386-B1 CURABLE COATING COMPOSITIONS EASTMAN CHEM CO (US) 2024-02-21 EP claimed
US-11447670-B2 Curable acetoacetylated resin compositions comprising aldehydes and certain basic catalysts EASTMAN CHEMICAL COMPANY (US) 2022-09-20 US claimed
US-20220056171-A1 Isocyanate Free Binder ARXADA AG (CH) 2022-02-24 US claimed
US-20210388229-A1 CURABLE COATING COMPOSITIONS EASTMAN CHEMICAL COMPANY (US) 2021-12-16 US claimed
EP-3909702-A1 ISOCYANATE FREE BINDER Lonza Solutions AG (CH) 2021-11-17 EP claimed
EP-3894386-A1 CURABLE COATING COMPOSITIONS Eastman Chemical Company (US) 2021-10-20 EP claimed
CN-113438992-A Isocyanate-free adhesives 隆萨解决方案股份公司 2021-09-24 CN claimed
CN-113166033-A Curable coating compositions 伊士曼化工公司 2021-07-23 CN claimed
WO-2020123278-A1 CURABLE COATING COMPOSITIONS EASTMAN CHEMICAL COMPANY (US) 2020-06-18 WO claimed
US-20200181465-A1 CURABLE ACETOACETYLATED RESIN COMPOSITIONS COMPRISING ALDEHYDES AND CERTAIN BASIC CATALYSTS EASTMAN CHEMICAL COMPANY (US) 2020-06-11 US claimed
CN-1047149-A Improved the photohardenable electrostatic element of environmental suitability DU PONT (US) 1990-11-21 CN claimed
US-12378434-B2 Curable coating compositions EASTMAN CHEMICAL COMPANY (US) 2025-08-05 US disclosed
EP-4574867-A1 CURABLE POLYMER COMPOSITIONS CONTAINING ISOCYANATES, ALDIMINES AND COMPOUNDS HAVING ACTIVATED METHYLENE GROUPS Sika Technology AG (CH) 2025-06-25 EP disclosed
CN-1043798-A Make bubble-free, as to have applied liquid solder mask printed circuit board (PCB) by pressurized with fluid DU PONT (US) 1990-07-11 CN disclosed
CN-1043800-A Improve the conformation that vacuum-laminated solder is covered coated printed circuit boards with the pressurized with fluid method DU PONT (US) 1990-07-11 CN disclosed