SCHEMBL2711089

SCHEMBL2711089

O=C(O)c1ccc(Oc2ccccc2-c2ccccc2-c2ccccc2-c2ccccc2Oc2ccc(C(=O)O)c(C34CC5CC(CC(C5)C3)C4)c2)cc1C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.44
HIF1A Q16665 1/20 0.40
EPAS1 Q99814 1/20 0.40
RARB P10826 5/20 0.39
RARG P13631 5/20 0.39
RARA P10276 4/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
NR1I2 O75469 1/20 0.39
LMNA P02545 1/20 0.39
PGR P06401 1/20 0.39
HSPD1 P10809 1/20 0.39
GOT1 P17174 1/20 0.39
GLRA1 P23415 1/20 0.39
BLM P54132 1/20 0.39
HSPE1 P61604 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
EPHX2 P34913 3/20 0.39
ALDH1A1 P00352 1/20 0.37
TP53 P04637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2706851 0.89 KDM4E (0.41) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL2711083 0.87 RARB (0.42) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL2706916 0.84 EPHX2 (0.45) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL2706843 0.82 HIF1A (0.42) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL16046931 0.79 RARB (0.46) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL2709102 0.79 NCOA1 (0.40) RARBRARGRARAMEN1KMT2A
SCHEMBL6878528 0.78 KMT2A (0.51) KDM4ERARBRARGRARAMEN1
SCHEMBL2709132 0.78 RARB (0.45) KDM4EHIF1AEPAS1RARBRARG
SCHEMBL2711079 0.77 RARG (0.53) KDM4ERARBRARGRARAMEN1
SCHEMBL2708781 0.76 POLB (0.44) KDM4EHIF1AEPAS1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed