⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL28433994 | 0.89 | — | — | |
| Phosphine SCHEMBL28464809 | 0.89 | — | — | |
| Phosphine SCHEMBL27724110 | 0.87 | — | — | |
| SCHEMBL2351686 | 0.87 | — | — | |
| Phosphine SCHEMBL28391628 | 0.87 | — | — | |
| Phosphine SCHEMBL28508288 | 0.87 | — | — | |
| SCHEMBL23834440 | 0.75 | — | — | |
| Hydrogen Sulfide SCHEMBL1492021 | 0.75 | — | — | |
| SCHEMBL16713738 | 0.75 | — | — | |
| SCHEMBL147982 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240017359-A1 | Copper-phosphorus-zinc-tin Brazing Sheet and Preparation Method and Use thereof | ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD. (CN) | 2024-01-18 | — | — | US | claimed |
| CN-114932336-B | Copper-phosphorus-zinc tin soldering chip and preparation method and application thereof | 郑州机械研究所有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-114932336-A | Copper-phosphorus-zinc-tin soldering lug and preparation method and application thereof | 郑州机械研究所有限公司 | 2022-08-23 | — | — | CN | claimed |
| US-20240017359-A1 | Copper-phosphorus-zinc-tin Brazing Sheet and Preparation Method and Use thereof | ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD. (CN) | 2024-01-18 | — | — | US | disclosed |
| US-20240017359-A1 | Copper-phosphorus-zinc-tin Brazing Sheet and Preparation Method and Use thereof | ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD. (CN) | 2024-01-18 | — | — | US | disclosed |
| CN-113209978-B | Organosilicon high-activity ternary copper catalyst and preparation method thereof | 江苏库博德金属科技有限公司 | 2023-08-29 | — | — | CN | disclosed |
| CN-114932336-B | Copper-phosphorus-zinc tin soldering chip and preparation method and application thereof | 郑州机械研究所有限公司 | 2023-05-23 | — | — | CN | disclosed |
| CN-114932336-B | Copper-phosphorus-zinc tin soldering chip and preparation method and application thereof | 郑州机械研究所有限公司 | 2023-05-23 | — | — | CN | disclosed |
| CN-114932336-A | Copper-phosphorus-zinc-tin soldering lug and preparation method and application thereof | 郑州机械研究所有限公司 | 2022-08-23 | — | — | CN | disclosed |
| CN-114932336-A | Copper-phosphorus-zinc-tin soldering lug and preparation method and application thereof | 郑州机械研究所有限公司 | 2022-08-23 | — | — | CN | disclosed |
| CN-113209978-A | Organic silicon high-activity ternary copper catalyst and preparation method thereof | 江苏库博德金属科技有限公司 | 2021-08-06 | — | — | CN | disclosed |