⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10488988 | 0.62 | — | — | |
| SCHEMBL1150832 | 0.56 | — | — | |
| SCHEMBL1426403 | 0.56 | — | — | |
| SCHEMBL2004962 | 0.56 | — | — | |
| SCHEMBL2209560 | 0.53 | — | — | |
| SCHEMBL2414575 | 0.41 | — | — | |
| Hydrochloric Acid SCHEMBL2463652 | 0.38 | — | — | |
| SCHEMBL7104332 | 0.38 | — | — | |
| SCHEMBL1328 | 0.35 | — | — | |
| SCHEMBL23546 | 0.35 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1349 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115873169-A | Acrylate polymer, pressure-sensitive adhesive composition, protective film and display device | 中国乐凯集团有限公司 | 2023-03-31 | — | — | CN | claimed |
| EP-4748406-A1 | MEDICAL ADHESIVE AGENT AND MEDICAL ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| US-12637595-B2 | Pressure-sensitive adhesive sheet, optical member, and touch panel | NITTO DENKO CORPORATION (JP) | 2026-05-26 | — | — | US | disclosed |
| US-20260132314-A1 | ADHESIVE TAPE | ETERNAL MATERIALS CO., LTD. (TW) | 2026-05-14 | — | — | US | disclosed |
| US-12617985-B2 | Pressure-sensitive adhesive sheet and use thereof | NITTO DENKO CORPORATION (JP) | 2026-05-05 | — | — | US | disclosed |
| US-12588548-B2 | Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package | SEKISUI KASEI CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260058310-A1 | SEPARATOR, LITHIUM SECONDARY BATTERY EMPLOYING SAME, AND METHOD FOR MANUFACTURING SAME | SAMSUNG SDI CO LTD (KR) | 2026-02-26 | — | — | US | disclosed |
| EP-4692265-A1 | THREAD-SHAPED PRESSURE-SENSITIVE ADHESIVE BODY | Nitto Denko Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-12545815-B2 | Protective sheet | NITTO DENKO CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| EP-3904088-B1 | PROTECTIVE SHEET | NITTO DENKO CORP (JP) | 2026-01-28 | — | — | EP | disclosed |
| CN-1763141-A | Pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2006-04-26 | — | — | CN | disclosed |
| US-20060084735-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION | 2006-04-20 | — | — | US | disclosed |
| EP-1647586-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2006-04-19 | — | — | EP | disclosed |
| EP-1592058-A2 | Method of selective thermal release from a heat peelable sheet and corresponding apparatus | NITTO DENKO CORPORATION (JP) | 2005-11-02 | — | — | EP | disclosed |
| US-20050236107-A1 | Method of thermal adherend release and apparatus for thermal adherend release | NITTO DENKO CORPORATION | 2005-10-27 | — | — | US | disclosed |
| CN-1128610-C | Use of water-soluble copolymers as active ingredients in cosmetics | BASF AG (DE) | 2003-11-26 | — | — | CN | disclosed |
| US-6231876-B1 | COSMETICS WITH WATER SOLUBLE COPOLYMERS OF VINYLCARBOXAMIDE WITH VINYLIMIDAZOLE | BASF AKTIENGESELLSCHAFT (DE) | 2001-05-15 | — | — | US | disclosed |
| CN-1239421-A | Use of water-soluble copolymers as active ingredients in cosmetic formulations | BASF AG (DE) | 1999-12-22 | — | — | CN | disclosed |
| EP-0929285-A2 | USE OF WATER-SOLUBLE COPOLYMERS AS ACTIVE INGREDIENTS IN COSMETICS | BASF AKTIENGESELLSCHAFT (DE) | 1999-07-21 | — | — | EP | disclosed |
| WO-1998014164-A2 | USE OF WATER-SOLUBLE COPOLYMERS AS ACTIVE INGREDIENTS IN COSMETICS | BASF AKTIENGESELLSCHAFT (DE) | 1998-04-09 | — | — | WO | disclosed |