Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 2/20 | 0.31 |
| ▸ | CA2 | P00918 | 2/20 | 0.31 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.30 |
| ▸ | CA12 | O43570 | 1/20 | 0.30 |
| ▸ | CA9 | Q16790 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL321664 | 1.00 | TSHR (0.35) | TSHRTDP1ACHECA1CA2 | |
| SCHEMBL23581990 | 1.00 | TSHR (0.35) | TSHRTDP1ACHECA1CA2 | |
| Methyl Alcohol SCHEMBL12537550 | 0.95 | CA12 (0.32) | TSHRTDP1CA1CA2CYP19A1 | |
| Methylamine SCHEMBL27423917 | 0.95 | CA1 (0.33) | TSHRTDP1CA1CA2 | |
| Benzene SCHEMBL28894433 | 0.93 | CYP19A1 (0.31) | TSHRTDP1CYP19A1 | |
| SCHEMBL11591251 | 0.90 | TSHR (0.32) | TSHRTDP1 | |
| SCHEMBL1276560 | 0.86 | TSHR (0.41) | TSHRTDP1 | |
| SCHEMBL10738231 | 0.84 | EPHX1 (0.33) | CYP19A1 | |
| SCHEMBL30137673 | 0.83 | CA1 (0.32) | TSHRTDP1CA1CA2 | |
| SCHEMBL4455536 | 0.82 | TSHR (0.33) | TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 578 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| US-4093786-A | CYCLODODECANONE AND TERT-BUTYLHYDROPEROXIDE, USED AS CROSSLINKING AGENT | NIHON YUSHI CO., LTD. (JA) | 1978-06-06 | — | — | US | claimed |
| CN-115551909-B | Thermosetting silicone composition, sheet, and silicone cured product | 信越化学工业株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119923449-A | Adhesive composition, adhesive film, connection structure, and method for producing same | 株式会社力森诺科 | 2025-05-02 | — | — | CN | disclosed |
| CN-114787307-B | Anisotropic conductive film | 迪睿合株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-118974194-A | Adhesive composition, adhesive film for circuit connection, circuit connection structure, and method for producing same | 株式会社力森诺科 | 2024-11-15 | — | — | CN | disclosed |
| CN-118369376-A | Rubber composition, and rubber product and hose obtained using same | 住友理工株式会社 | 2024-07-19 | — | — | CN | disclosed |
| WO-2024150767-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150762-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150766-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| CN-1419592-A | Laminar articles containing layer of ethylene containing polymer elastomers containing aromatic resins | EXXONMOBIL CHEM PATENTS INC (US) | 2003-05-21 | — | — | CN | disclosed |
| WO-2003037971-A2 | PROCESS OF PRODUCING EXPANDED POLYPROPYLENE RESIN BEADS | JSP CORPORATION (JP) | 2003-05-08 | — | — | WO | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1223795-A1 | WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| WO-2002024794-A9 | EXPANDED POLYPROPYLENE RESIN BEAD | JSP CORP (JP) | 2002-05-10 | — | — | WO | disclosed |
| CN-1347437-A | Thermoplastic resin formed article having high-rigidity and high-strength | ASAHI CHEMICAL IND (JP) | 2002-05-01 | — | — | CN | disclosed |
| CN-1339055-A | Adhesive, electrode-connecting structure, and method of connecting electrodes | HITACHI CHEMICAL CO LTD (JP) | 2002-03-06 | — | — | CN | disclosed |
| CN-1308094-A | Polymer mixture and its preparation, photosensitive composite and pattern preparing method | TOYO COSEI KOGYO CO LTD (JP) | 2001-08-15 | — | — | CN | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |