SCHEMBL2733472

SCHEMBL2733472

CC(C)(I)CI

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2732422 0.80
SCHEMBL1111012 0.76
SCHEMBL77943 0.74
SCHEMBL11630875 0.73
SCHEMBL14534759 0.73
SCHEMBL31040517 0.70
SCHEMBL13932635 0.70
SCHEMBL1038317 0.70
SCHEMBL9938132 0.70
SCHEMBL2563802 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250069948-A1 DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS LAM RESEARCH CORPORATION (US) 2025-02-27 US claimed
EP-4448831-A1 DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS Lam Research Corporation (US) 2024-10-23 EP claimed
CN-118434908-A Metal deposition in recessed features using halogen-containing deposition inhibitors 朗姆研究公司 2024-08-02 CN claimed
WO-2023114640-A1 DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS LAM RESEARCH CORPORATION (US) 2023-06-22 WO claimed
US-20260136848-A1 DEPOSITION OF METAL-CONTAINING FILMS LAM RES CORP (US) 2026-05-14 US disclosed
US-20260035782-A1 METHOD AND SYSTEM FOR DEPOSITING METAL CARBIDE ON A SUBSTRATE ASM IP HOLDING BV (NL) 2026-02-05 US disclosed
US-20250069948-A1 DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS LAM RESEARCH CORPORATION (US) 2025-02-27 US disclosed
EP-4448831-A1 DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-CONTAINING DEPOSITION INHIBITORS Lam Research Corporation (US) 2024-10-23 EP disclosed
CN-118434908-A Metal deposition in recessed features using halogen-containing deposition inhibitors 朗姆研究公司 2024-08-02 CN disclosed
WO-2024081263-A1 DEPOSITION OF METAL-CONTAINING FILMS LAM RESEARCH CORPORATION (US) 2024-04-18 WO disclosed
US-11780823-B2 Indazole-3-carboxamides and their use as Wnt/β-catenin signaling pathway inhibitors BIOSPLICE THERAPEUTICS, INC. (US) 2023-10-10 US disclosed
US-20230242557-A9 PROTEASOME ACTIVITY ENHANCING COMPOUNDS Kineta, Inc. 2023-08-03 US disclosed
US-8088805-B2 Inhibitors of histone deacetylase METHYLGENE INC. (CA) 2012-01-03 US disclosed
US-7939318-B2 Flexible vaccine assembly and vaccine delivery platform KENTUCKY BIOPROCESSING, LLC (US) 2011-05-10 US disclosed
US-20100149446-A1 POLYMER-STABILIZED LIQUID CRYSTAL COMPOSITION, LIQUID CRYSTAL DISPLAY DEVICE, METHOD FOR PRODUCING LIQUID CRYSTAL DISPLAY DEVICE DIC CORPORATION (JP) 2010-06-17 US disclosed
US-20100044874-A1 INTEGRATED CIRCUIT OF DECREASED SIZE STMICROELECTRONICS (ROUSSET) SAS (FR) 2010-02-25 US disclosed
WO-2008076427-A2 NAPHTHALENONE COMPOUNDS EXHIBITING PROLYL HYDROXYLASE INHIBITORY ACTIVITY, COMPOSITIONS, AND USES THEREOF AMGEN INC. (US) 2008-06-26 WO disclosed
EP-0919870-B1 Photosensitive resin composition and photosensitive element using the resin composition NICHIGO MORTON CO LTD (JP) 2002-07-03 EP disclosed
US-6242158-B1 POLYMER WITH CARBOXY DERIVATIVES, ETHYLENE AND ACRYLIC ESTER DERIVATIVES NICHIGO-MORTON CO., LTD. (JP) 2001-06-05 US disclosed
EP-0919870-A1 Photosensitive resin composition and photosensitive element using the resin composition Nichigo-Morton Co Ltd (JP) 1999-06-02 EP disclosed