SCHEMBL2734952

SCHEMBL2734952

CCC(C)(C)C(=O)OCCCC(=O)OC(C)(CC)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.39

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 18/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL107131 0.89 EPHX2 (0.40) EPHX2
SCHEMBL107019 0.85 EPHX2 (0.34) EPHX2
SCHEMBL2735078 0.83 TSHR (0.40) EPHX2
SCHEMBL119887 0.81 KMT2A (0.34) EPHX2
SCHEMBL15450104 0.81 EPHX2 (0.36) EPHX2
SCHEMBL2734983 0.79 EPHX2 (0.43) EPHX2
SCHEMBL15290867 0.79 EPHX2 (0.33) EPHX2
SCHEMBL13594330 0.78 EPHX2 (0.36) EPHX2
SCHEMBL13527910 0.78 EPHX2 (0.38) EPHX2
SCHEMBL14839167 0.77 EPHX2 (0.35) EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8507172-B2 Positive resist composition and pattern forming method using the positive resist composition FUJIFILM CORPORATION (JP) 2013-08-13 US disclosed
US-8088550-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2012-01-03 US disclosed
US-20100040975-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION FUJIFILM CORPORATION (JP) 2010-02-18 US disclosed
US-20090035692-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-20090023096-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
US-20090017400-A1 PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2009-01-15 US disclosed