⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2740829 | 0.85 | — | — | |
| SCHEMBL20102189 | 0.79 | TDP1 (0.42) | — | |
| SCHEMBL2740842 | 0.78 | TDP1 (0.40) | — | |
| SCHEMBL14713833 | 0.72 | TDP1 (0.39) | — | |
| SCHEMBL5181096 | 0.71 | — | — | |
| SCHEMBL5179766 | 0.71 | ANPEP (0.35) | — | |
| Methylsulfanylmethane SCHEMBL9173804 | 0.68 | — | — | |
| SCHEMBL4153980 | 0.68 | TDP1 (0.33) | — | |
| SCHEMBL12599527 | 0.67 | SLC2A1 (0.47) | — | |
| SCHEMBL11340107 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 135 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10928727-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank including actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing | FUJIFILM CORPORATION (JP) | 2021-02-23 | — | — | US | disclosed |
| US-10859914-B2 | Pattern forming method, method for producing electronic device, and actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development | FUJIFILM CORPORATION (JP) | 2020-12-08 | — | — | US | disclosed |
| US-10852637-B2 | Pattern forming method, resist pattern, method for manufacturing electronic device, and composition for forming upper layer film | FUJIFILM CORPORATION (JP) | 2020-12-01 | — | — | US | disclosed |
| US-10761426-B2 | Pattern forming method, method for manufacturing electronic device, and laminate | FUJIFILM CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-10663864-B2 | Pattern forming method, method for manufacturing electronic device, and laminate | FUJIFILM CORPORATION (JP) | 2020-05-26 | — | — | US | disclosed |
| US-10578968-B2 | Pattern forming method, resist pattern, and process for producing electronic device | FUJIFILM CORPORATION (JP) | 2020-03-03 | — | — | US | disclosed |
| US-10444627-B2 | Pattern formation method, active light-sensitive or radiation-sensitive resin composition, resist film, production method for electronic device using same, and electronic device | FUJIFILM CORPORATION (JP) | 2019-10-15 | — | — | US | disclosed |
| US-10394127-B2 | Pattern forming method and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| EP-2756353-B1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORP (JP) | 2019-05-01 | — | — | EP | disclosed |
| US-10175578-B2 | Pattern forming method, composition for forming protective film, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2019-01-08 | — | — | US | disclosed |
| WO-2013081184-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND RESIN | FUJIFILM CORPORATION (JP) | 2013-06-06 | — | — | WO | disclosed |
| WO-2013047902-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN | FUJIFILM CORPORATION (JP) | 2013-04-04 | — | — | WO | disclosed |
| WO-2013039243-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-03-21 | — | — | WO | disclosed |
| US-20130045445-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2013-02-21 | — | — | US | disclosed |
| US-20130045445-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2013-02-21 | — | — | US | disclosed |
| US-20120231393-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING A PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-09-13 | — | — | US | disclosed |
| US-20120231393-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING A PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-09-13 | — | — | US | disclosed |
| US-20120003590-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-01-05 | — | — | US | disclosed |
| US-20120003590-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-01-05 | — | — | US | disclosed |
| WO-2011034212-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING A PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-03-24 | — | — | WO | disclosed |