SCHEMBL27437495

SCHEMBL27437495

CC(OC(=O)C(C1CCCCC1)C1CCCCC1)C(=O)OC1CCCCC1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.47
EPHX1 P07099 3/20 0.40
NAAA Q02083 2/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
HTT P42858 1/20 0.34
TP53 P04637 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.33
GAA P10253 1/20 0.33
ALDH1A1 P00352 2/20 0.33
NPSR1 Q6W5P4 1/20 0.33
CA12 O43570 2/20 0.33
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
MMP2 P08253 2/20 0.33
CA9 Q16790 2/20 0.33
CYP2C19 P33261 1/20 0.33
LMNA P02545 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2D6 P10635 1/20 0.32
SCN1A P35498 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23323307 0.84 CYP19A1 (0.46) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL8150350 0.84 EPHX1 (0.50) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL27569372 0.84 EPHX1 (0.50) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL23930274 0.84 EPHX1 (0.50) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL873008 0.84 EPHX1 (0.50) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL27528551 0.84 EPHX1 (0.50) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL7061111 0.81 CYP19A1 (0.46) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL7061110 0.81 CYP19A1 (0.46) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL30051057 0.79 CYP19A1 (0.45) CYP19A1EPHX1NAAAL3MBTL1HTT
SCHEMBL4677958 0.79 CYP19A1 (0.44) CYP19A1EPHX1NAAAL3MBTL1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed