SCHEMBL2746853

SCHEMBL2746853

NC1CCCC(=O)C1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15312813 0.75
SCHEMBL6899302 0.75
SCHEMBL16204606 0.75
SCHEMBL16204599 0.75
SCHEMBL20837321 0.75
SCHEMBL3630111 0.72
SCHEMBL20979414 0.72
SCHEMBL13640234 0.72
Hydrochloric Acid SCHEMBL423807 0.70
Hydrochloric Acid SCHEMBL421115 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1873181-B1 Curing agent for epoxy resin and coating composition AIR PROD & CHEM (US) 2012-08-01 EP disclosed
US-8178598-B2 Polyoxyalkylene polyamide-glycidyl ether adduct epoxy resin curing agent AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-05-15 US disclosed
EP-1666457-B1 Trans-1,2-cyclohexane bis(urea-urethane) compounds XEROX CORP (US) 2009-05-27 EP disclosed
EP-1321487-B1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE MITSUI CHEMICALS INC (JP) 2008-02-27 EP disclosed
US-20080045659-A1 Curing agent for epoxy resin and coating composition AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-02-21 US disclosed
EP-1666548-B1 Phase change inks containing trans-1,2-cyclohexane bis(urea-urethane) compounds XEROX CORP (US) 2008-01-09 EP disclosed
EP-1873181-A2 Curing agent for epoxy resin and coating composition Air Products and Chemicals, Inc. (US) 2008-01-02 EP disclosed
EP-1666548-A1 Phase change inks containing trans-1,2-cyclohexane bis(urea-urethane) compounds Xerox Corporation (US) 2006-06-07 EP disclosed
US-6710160-B2 VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS MITSUI CHEMICALS, INC. (JP) 2004-03-23 US disclosed
EP-1321487-A1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE Mitsui Chemicals, Inc. (JP) 2003-06-25 EP disclosed
US-20020188090-A1 Polyamic acid, polyimide, process for producing these, and film of the polyimide MITSUI CHEMICALS, INC. (JP) 2002-12-12 US disclosed