⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8028254 | 0.72 | — | — | |
| SCHEMBL514322 | 0.70 | — | — | |
| SCHEMBL20287542 | 0.67 | — | — | |
| SCHEMBL24355435 | 0.67 | — | — | |
| SCHEMBL22746513 | 0.67 | — | — | |
| SCHEMBL20844097 | 0.67 | — | — | |
| SCHEMBL8432459 | 0.65 | — | — | |
| SCHEMBL23106239 | 0.65 | — | — | |
| SCHEMBL2483282 | 0.63 | — | — | |
| SCHEMBL18361475 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-1131675-A | Grosslinked acidic polysaccharides and their uses | HERCULES INC (US) | 1996-09-25 | — | — | CN | claimed |
| CN-102119156-B | Substituted pyrroles and methods of use | GENENTECH INC | 2015-01-21 | — | — | CN | disclosed |
| CN-102119162-B | Diazacarbazoles and methods of use | GENENTECH, INC. (US) | 2014-10-08 | — | — | CN | disclosed |
| CN-103476894-A | Adhesive, adhesive material using same, and method for using same | HITACHI CHEMICAL CO LTD | 2013-12-25 | — | — | CN | disclosed |
| CN-103476895-A | Adhesive, adhesive material using same, and method for using same | HITACHI CHEMICAL CO LTD | 2013-12-25 | — | — | CN | disclosed |
| CN-103459544-A | Adhesive and adhesive material using same, and usage method therefor | HITACHI CHEMICAL CO LTD | 2013-12-18 | — | — | CN | disclosed |
| CN-103443158-A | Carboxyl group-ontaining polyimide, heat-curable resin composition, and flexible metal-clad laminate | TOYO BOSEKI | 2013-12-11 | — | — | CN | disclosed |
| CN-102131882-B | Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component | HITACHI CHEMICAL CO LTD | 2013-10-30 | — | — | CN | disclosed |
| CN-101445714-B | Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection | HITACHI CHEMICAL CO LTD | 2013-03-20 | — | — | CN | disclosed |
| CN-101128543-B | Resin composition and film-forming material comprising the same | HITACHI CHEMICAL CO LTD | 2013-02-13 | — | — | CN | disclosed |
| CN-1950475-A | Resin paste for die bonding | HITACHI CHEMICAL CO LTD (JP) | 2007-04-18 | — | — | CN | disclosed |
| CN-1309761-C | Adhesive resin and film adhesives made by using the same | MITSUI CHEMICALS INC (JP) | 2007-04-11 | — | — | CN | disclosed |
| CN-1916097-A | Adhesive sheet and semiconductor device and process for producing the same | HITACHI CHEMICAL CO LTD (JP) | 2007-02-21 | — | — | CN | disclosed |
| CN-1898298-A | Aromatic polyamic acid and polyimide | NIPPON STEEL CHEMICAL CO (JP) | 2007-01-17 | — | — | CN | disclosed |
| CN-1802421-A | Film-like adhesive, method for producing same, adhesive sheet, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2006-07-12 | — | — | CN | disclosed |
| CN-1649936-A | Adhesive resin and film adhesives made by using the same | MITSUI CHEMICALS INC (JP) | 2005-08-03 | — | — | CN | disclosed |
| CN-1637034-A | Polyurethane-imide resin, adhesive composition, and adhesive composition for circuit connection | HITACHI CHEMICAL CO LTD (JP) | 2005-07-13 | — | — | CN | disclosed |
| CN-1633487-A | Adhesive sheet, semiconductor device and method for manufacturing the same | HITACHI CHEMICAL CO LTD (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1206259-C | Polyimide resin for bonding and adhesive laminate | NIPPON STEEL CHEMICAL CO (JP) | 2005-06-15 | — | — | CN | disclosed |
| CN-1406262-A | Polyimide resin for bonding and adhesive laminate | NIPPON STEEL CHEMICAL CO (JP) | 2003-03-26 | — | — | CN | disclosed |